IP Library Granted Patent US 7,705,668
Granted Patent B2
US 7,705,668 · App. 12/314,379 · Granted Apr 27, 2010

Mobile telephone with interblock control for power conservation

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Quick Facts
Patent No.
US 7,705,668
App. No.
12/314,379
Granted
Apr 27, 2010
Kind
B2
Abstract

A mobile telephone is provided that includes a plurality of circuit blocks and adapted to cut off the supply of power source voltage to any one of the circuit blocks. The mobile telephone also includes an interblock interface circuit provided on a signal path between an elected circuit block and a branch point at which the signal path branches into different branch paths so as to connect to other circuit blocks. The interblock interface circuit includes a signal gate for preventing signal transmission from the elected circuit block to the other circuit blocks, and includes a storage unit for storing a signal right before the power cut-off.

Claims (41)

1. A mobile telephone comprising:

an antenna;

a high frequency module coupled to the antenna;

a base band LSI coupled to the high frequency module;

a first bus coupled to the base band LSI;

a second bus; and

a microprocessor on a semiconductor chip, the microprocessor including:

a first pad coupled to the first bus,

a second pad coupled to the second bus,

a bypass line coupled between the first pad and the second pad;

a first circuit block including a CPU

a second circuit block including a first circuit and a second circuit, and

a third circuit coupled between the first circuit block and the second circuit and whose operation is controlled by the first circuit preventing signals of the first circuit block from being input to the second circuit block when the first circuit block is in a standby mode,

wherein the base band LSI is capable of providing data to the second bus using the bypass line when the first circuit block is in the standby mode.

2. A mobile telephone according to claim 1 , further comprising:

a LCD panel coupled to the second bus,

wherein the base band LSI provides data to the LCD panel via the bypass line and the second bus when the first circuit block is in the standby mode.

3. A mobile telephone comprising:

an antenna;

a high frequency module coupled to the antenna;

a base band LSI coupled to the high frequency module; and

a microprocessor on a semiconductor chip, the microprocessor including:

a first pad coupled to the base band LSI,

a second pad,

a bypass line coupled between the first pad and the second pad,

a first circuit block including a CPU,

a second circuit block including a first circuit and a second circuit, and

a third circuit coupled between the first circuit block and the second circuit and whose operation is controlled by the first circuit preventing signals of the first circuit block from being input to the second circuit block when the first circuit block is in a mode where a supply of a power source to the first circuit block is cut off,

wherein the base band LSI is capable of providing data to the second pad using the bypass line when the first circuit block is in the mode.

4. A mobile telephone according to claim 3 , further comprising:

a LCD panel coupled to the second pad,

wherein the base band LSI provides data to the LCD panel via the bypass line and the second pad when the first circuit block is in the mode.

5. A mobile telephone comprising:

an antenna;

a high frequency module coupled to the antenna;

a semiconductor integrated circuit coupled to the high frequency module; and

a circuit coupled to the semiconductor integrated circuit,

wherein the semiconductor integrated circuit includes:

a first circuit block including a microprocessor,

a second circuit block for a base band processing, and

a third circuit preventing signals of the first circuit block from being input to the second circuit block when the first circuit block is in a mode where a supply of a power source to the first circuit block is cut off.

Assignments (4)
CHANGE OF ADDRESS Recorded Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
MERGER Recorded May 11, 2011
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 026326/0102 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2008
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 023757/0273 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2008
From: HOSHI, TADASHI; HIROSE KENJI; ABE, HIDEAKI; NISHIMOTO, JUNICHI; NAGAYAMA, MIDORI
To: HITACHI, LTD.
Reel/Frame 022028/0566 →