Patent Assignment
Reel/Frame 026326/0102
Merger
Recorded: 2011-05-11
Pages: 12
Assignor
RENESAS TECHNOLOGY CORP.
Executed: 2010-04-13
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Properties
(30)
Planarizing Method of Semiconductor Wafer and Apparatus Thereof
Semiconductor Device and Data Processing System
Data Hold Circuit, a Semiconductor Device and a Method of Designing the Same
Variable Logical Circuit, Semiconductor Integrated Circuit, and Method for Manufacturing Semiconductor Integrated Circuit
Patent:
6,724,647 →
Application:
10/069,453 →
Multiple Circuit Blocks with Interblock Control and Power Conservation
Magnetic Disk Storage Apparatus
Data Processor
Imaging System Using Solid-State Cmos Imaging Device
Semiconductor Integrated Circuit Device with Reduced Leakage Current
Semiconductor Device with Non-Volatile Memory and Random Access Memory
Analog Switch Circuit
Semiconductor Device and Its Manufacturing Method with Leads That Have an Inverted Trapezoid-Like Section
Multiple Circuit Blocks with Interblock Control and Power Conservation
Semiconductor Memory Device Having Short Refresh Time
Semiconductor Device
Impedance Matching Commonly and Independently
Semiconductor Device and an Image Processor
Multiple Circuit Blocks with Interblock Control and Power Conservation
Semiconductor Integrated Circuit Device with Reduced Leakage Current
Semiconductor Integrated Circuit Device with Reduced Leakage Current
Multiple Circuit Blocks with Interblock Control and Power Conservation
Multiple Circuit Blocks with Interblock Control and Power Conservation
Multiple Circuit Blocks with Interblock Control and Power Conservation
Semiconductor Integrated Circuit Device with Reduced Leakage Current
Semiconductor Device
Light Emitting Device Having a Mirror Portion
Semiconductor Integrated Circuit Device with Reduced Leakage Current
Semiconductor Device and an Image Processor
Mobile Telephone with Interblock Control for Power Conservation
Semiconductor Integrated Circuit Device with Reduced Leakage Current
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 25, 2003
From: HASEBE, HAJIME; FUJISAWA, ATSUSHI; AIDA, MAKOTO; MOTOYA, ISHIDA
To: HITACHI, LTD.; HITACHI CABLE, LTD.; RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 014714/0631 →
Assignment of Assignor's Interest
Aug 5, 2003
From: HOSHI, TADASHI; HIROSE, KENJI; ABE, HIDEAKI; NISHIMOTO, JUNICHI
To: HITACHI, LTD.
Reel/Frame 014374/0551 →
Assignment of Assignor's Interest
Sep 22, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014511/0672 →
Assignment of Assignor's Interest
Sep 23, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014520/0593 →
Assignment of Assignor's Interest
Oct 1, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014573/0096 →
Assignment of Assignor's Interest
Oct 1, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014568/0160 →
Assignment of Assignor's Interest
Jan 13, 2004
From: HITACHI, LTD.; RENESAS NORTHERN JAPAN SEMICONDUCTOR,INC.; HITACHI CABLE, LTD.
To: RENESAS TECHNOLOGY CORPORATION; HITACHI CABLE, LTD.; RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 014882/0393 →
Assignment of Assignor's Interest
Nov 8, 2004
From: ITANO, NORIYUKI; MITSUMOTO, KINYA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015974/0972 →
Assignment of Assignor's Interest
Nov 9, 2004
From: UENO, HIROKI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015970/0931 →
Assignment of Assignor's Interest
Mar 17, 2005
From: WATANABE, HIROMI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 016366/0655 →
Change of Name
Jun 30, 2005
From: HITACHI DEVICE ENGINEERING CO., LTD.
To: HITACHI DISPLAY DEVICES, LTD.
Reel/Frame 016737/0101 →
Assignment of Assignor's Interest
Jul 1, 2005
From: HITACHI DISPLAY DEVICES, LTD.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 016741/0514 →
Assignment of Assignor's Interest
Nov 28, 2006
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 018559/0281 →
Assignment of Assignor's Interest
Jan 9, 2012
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 027607/0555 →
Change of Name
Dec 6, 2013
From: HITACHI CABLE, LTD.
To: SH MATERIALS CO., LTD.
Reel/Frame 031735/0485 →
Assignment of Assignor's Interest
May 9, 2014
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 032859/0252 →
Merger
Mar 4, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 041909/0582 →
Change of Name
Mar 4, 2017
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 041891/0030 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Assignment of Assignor's Interest
Apr 20, 2018
From: SH MATERIALS CO., LTD.
To: SH PRECISION CO., LTD.
Reel/Frame 045602/0870 →