IP Library Granted Patent US 8,143,525
Granted Patent B2
US 8,143,525 · App. 12/314,772 · Granted Mar 27, 2012

Solar cell lead wire and production method therefor and solar cell using same

Assignees: Hitachi Cable, Ltd.; Hitachi Cable Fine-Tech, Ltd.
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Quick Facts
Patent No.
US 8,143,525
App. No.
12/314,772
Granted
Mar 27, 2012
Kind
B2
Abstract

A solar cell lead wire includes a strip-shaped conductive material formed by rolling a wire, and upper and lower melt solder-plated layers formed to be flat on upper and lower surfaces, respectively, of the strip-shaped conductive material by supplying melt solder thereto.

Claims (22)

1. A solar cell lead wire, comprising:

a strip-shaped conductive material formed by rolling a wire with a circular cross section; and

upper and lower melt solder-plated layers comprising flat upper and lower surfaces, respectively, of the strip-shaped conductive material by supplying melt solder thereto.

2. The solar cell lead wire according to claim 1 , wherein the strip-shaped conductive material comprises a rectangular wire whose volume resistivity is not more than 50 μΩ·mm.

3. The solar cell lead wire according to claim 1 , wherein the strip-shaped conductive material comprises one of Cu, Al, Ag and Au.

4. The solar cell lead wire according to claim 1 , wherein the strip-shaped conductive material comprises one of a tough pitch Cu, a low oxygen Cu, an oxygen-free Cu, a phosphorous deoxidized Cu, and a high purity Cu whose purity is not less than 99.9999%.

5. The solar cell lead wire according to claim 1 , wherein the melt solder-plated layers comprise a Sn-based solder or a Sn-based solder alloy containing Sn as a first component, and not less than 0.1 mass % of at least one element selected from Pb, In, Bi, Sb, Ag, Zn, Ni, and Cu, as a second component.

6. A solar cell, comprising:

the solar cell lead wire according to claim 1 ; and

a semiconductor substrate comprising frontside and backside electrodes,

wherein the solar cell lead wire is soldered to the frontside and backside electrodes of the semiconductor substrate with the solder of the melt solder-plated layers.

7. The solar cell lead wire according to claim 1 , wherein the strip-shaped conductive material comprises the wire with the circular cross section.

8. The solar cell lead wire according to claim 1 , wherein said flat upper and lower surfaces of the upper and lower melt solder-plated layers respectively extend from an edge of the upper and lower melt solder-plated layers to another edge of the upper and lower melt solder-plated layers.

9. The solar cell lead wire according to claim 1 , wherein a thickness of the lower melt solder-plated layer is at least 5 μm at both ends.

10. The solar cell lead wire according to claim 1 , wherein a thickness at both ends of the lower melt solder-plated layer is specified in a predetermined range, and

wherein the lower surface thereof is depressed.

11. A production method for a solar cell lead wire, said method comprising:

rolling a wire with a circular cross section to thereby form a strip-shaped conductive material;

heating the strip-shaped conductive material in a continuous current heating furnace, a continuous heating furnace, or a batch-type heating equipment;

subsequently supplying melt solder to solder-plate the strip-shaped conductive material; and

sandwiching the plated strip-shaped conductive material between rolls to thereby form flat melt solder-plated layers.

12. The method according to claim 11 , wherein a thickness of one of the melt solder-plated layers, which is disposed on a lower surface of the strip-shaped conductive material, is at least 5 μm.

Assignments (4)
NUNC PRO TUNC ASSIGNMENT Recorded Jul 30, 2025
From: HITACHI CABLE FINE-TECH, LTD.
To: HITACHI CABLE LTD.
Reel/Frame 071875/0741 →
MERGER Recorded Jul 30, 2025
From: HITACHI CABLE, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 071875/0917 →
CHANGE OF NAME Recorded Jul 30, 2025
From: HITACHI METALS, LTD.
To: PROTERIAL, LTD.
Reel/Frame 071876/0799 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 16, 2008
From: NISHI, HAJIME; ENDO, YUJU; AKUTSU, HIROYUKI; BANDO, HIROSHI; HIGASHIDANI, IKU; SAWAHATA, KATSUNORI; ITO, YUKIO; OKIKAWA, HIROSHI
To: HITACHI CABLE, LTD.; HITACHI CABLE FINE-TECH, LTD.
Reel/Frame 022054/0055 →
Priority Claims (3)
JP 2008-106177 · Apr 15, 2008 · national
JP 2008-144820 · Jun 2, 2008 · national
JP 2008-189768 · Jul 23, 2008 · national
Continuity (1)
Related Publication 20090255710A1 · Oct 15, 2009