Method for microfabricating a probe with integrated handle, cantilever, tip and circuit
View Patent ↗A simple method for integrating a circuit onto a probe with a handle, a cantilever and a tip is provided. By fabricating a probe whose surface has recessed patterns of the desirable profile, a circuit can be formed on one part of the handle out over the cantilever and back onto a different part of the handle without employing a circuit lithography step. The circuit material constituting the circuit is deposited orthogonally to the probe surface with a line-of-sight technique.
1. A probe for a probe-based instrument, comprising:
a) a cantilever,
b) a first handle mount,
c) a second handle mount that is separated from the first handle mount by a space,
d) a handle having a first side attached to a second side of the first and the second handle mounts, and
e) an electrical circuit loop formed by a circuit layer that is deposited on a first side of the first handle mount, a first side of the cantilever, a first side of the second handle mount and on a portion of the handle exposed in the space between the first and the second handle mounts such that a portion of the circuit layer located on the handle does not contact a portion of the circuit layer located on the first and the second handle mounts and is not part of the electrical current loop.
2. The probe of claim 1 , wherein the cantilever comprises a first leg that is connected to the first handle mount, and a second leg that is connected to the second handle mount.
3. The probe of claim 1 , wherein the circuit layer comprises gold and the cantilever comprises silicon nitride.
4. The probe of claim 1 , wherein the cantilever further comprises a tip located on the first side of the cantilever.
5. The probe of claim 1 , wherein a thickness of the handle under the space between the first and the second handle mounts is less than a thickness of the handle under the first and the second handle mounts.
6. The probe of claim 1 , wherein the first side of the handle has a recess area, such that a portion of the second side of the first handle mount and a portion of the second side of the second handle mount overhang sidewalls of the recess area.
7. The probe of claim 1 , wherein the probe does not comprise a piezoelectric actuator.
8. The probe of claim 1 , further comprising a reflective layer on a second side of the cantilever.
9. A method of making a probe for a probe-based instrument, comprising:
(A) providing a probe structure, comprising:
a) a cantilever,
b) a first handle mount,
c) a second handle mount that is separated from the first handle mount by a space, and
d) a handle having a first side attached to a second side of the first and the second handle mounts, and
(B) depositing a circuit layer on a first side of the first handle mount, a first side of the cantilever, a first side of the second handle mount and on a portion of the handle exposed in the space between the first and the second handle mounts to form an electrical circuit loop, wherein a portion of the circuit layer located on the handle does not contact a portion of the circuit layer located on the first and second handle mounts and is not part of the electrical current loop.
10. The method of claim 9 , wherein said providing the cantilever of the probe structure further comprises a tip on the first side of the cantilever.
11. The method of claim 10 , wherein said providing the probe structure comprises:
i) providing a substrate,
ii) forming an inverted tip into the substrate,
iii) depositing a thin film, which includes the cantilever and the first and second handle mounts, on the substrate over the inverted tip,
iv) attaching the handle to the first and the second handle mounts, and
v) removing the substrate from the thin film to expose the cantilever and the first and the second handle mounts attached to the handle.
12. The method of claim 11 , wherein the thin film comprises silicon nitride.
13. The method of claim 11 , wherein the step of attaching comprises anodically bonding the handle to the first and the second handle mounts.
14. The method of claim 9 , wherein the handle has a recessed area below the space and each of the first and the second handle mounts overhangs a portion of the recessed area.
15. The method of claim 9 , wherein said circuit layer comprises gold.
16. The method of claim 9 , further comprising depositing a reflective layer on a second side of the cantilever.
17. The method of claim 9 , wherein said depositing does not comprise lithographic patterning of the circuit layer.
18. A method of using a probe-based instrument, comprising:
providing a probe, comprising:
a) a cantilever,
b) a first handle mount,
c) a second handle mount that is separated from the first handle mount by a space,
d) a handle having a first side attached to a second side of the first and the second handle mounts, and
e) an electrical circuit loop formed by a circuit layer that is deposited on a first side of the first handle mount, a first side of the cantilever, a first side of the second handle mount and on a portion of the handle exposed in the space between the first and the second handle mounts such that a portion of the circuit layer located on the handle does not contact a portion of the circuit layer located on the first and the second handle mounts and is not part of the electrical current loop, and
actuating the cantilever by providing electrical current through the electrical circuit loop.
19. The method of claim 18 , wherein said actuating utilizes thermal mechanical forces or magnetic forces in the circuit loop.
20. The method of claim 18 , wherein said probe does not comprise a piezo-electric actuator.
21. The method of claim 18 , wherein the probe based instrument is an atomic force microscope.
22. The method of claim 21 , wherein said actuating is performed in an AC mode of the atomic force microscope.
23. The method of claim 18 , wherein the cantilever comprises silicon nitride and the circuit layer comprises gold.
24. The method of claim 18 , wherein the cantilever further comprises a tip on the first side of the cantilever.
25. The method of claim 18 , wherein the cantilever comprises a first leg that is connected to the first handle mount, and a second leg that is connected to the second handle mount.
26. The method of claim 18 , further comprising sensing a mechanical response of said cantilever using the circuit loop.