Extended thermal management
View Patent ↗A method for managing thermal condition of a thermal zone that includes multiple thermally controllable components include determining thermal relationship between the components and reducing temperature of a first component by reducing thermal dissipation of a second component.
1. A non-transitory computer-readable medium containing computer instructions stored therein for causing a computer processor to perform a method comprising:
reading a thermal relationship table to determine a first thermal influence amount a first device has on a second device, wherein the first device and second device are located in a single thermal zone; and
making a thermal policy decision affecting at least the thermal condition of the second device in response to determining the first thermal influence amount.
2. The computer-readable medium of claim 1 , wherein the first thermal influence amount the first device has on the second device further comprises:
an amount of temperature increase the second device experiences per additional Watt of thermal load the first device generates.
3. The computer-readable medium of claim 1 , wherein the performed method further comprises:
increasing at least one active cooling solution present in the thermal zone in response to the thermal policy decision.
4. The computer-readable medium of claim 1 , wherein the performed method further comprises:
increasing at least one passive cooling solution present in the thermal zone in response to the thermal policy decision.
5. The computer-readable medium of claim 1 , wherein the performed method further comprises:
utilizing at least one user preference setting to determine a thermal policy preference by a user prior to making the thermal policy decision.
6. The computer-readable medium of claim 1 , wherein the performed method further comprises:
reading the thermal relationship table to determine a second thermal influence amount all devices in the thermal zone have on a third device, the third device comprising one of the devices in the thermal zone; and
making a thermal policy decision affecting at least the thermal condition of the third device in response to determining the second thermal influence amount.
7. A power management apparatus, comprising:
storage to store a thermal relationship table; and
logic to
read the thermal relationship table to determine a first thermal influence amount a first device has on a second device, wherein the first device and second device are located in a single thermal zone; and
make a thermal policy decision affecting at least the thermal condition of the second device in response to determining the first thermal influence amount.
8. The power management apparatus of claim 7 , wherein the first thermal influence amount the first device has on the second device further comprises:
an amount of temperature increase the second device experiences per additional Watt of thermal load the first device generates.
9. The power management apparatus of claim 7 , wherein the logic is further operable to:
increase at least one active cooling solution present in the thermal zone in response to the thermal policy decision.
10. The power management apparatus of claim 7 , wherein the logic is further operable to:
increasing at least one passive cooling solution present in the thermal zone in response to the thermal policy decision.
11. The power management apparatus of claim 7 , wherein the logic is further operable to:
utilize at least one user preference setting to determine a thermal policy preference by a user prior to making the thermal policy decision.
12. The power management apparatus of claim 7 , wherein the logic is further operable to:
read the thermal relationship table to determine a second thermal influence amount all devices in the thermal zone have on a third device, the third device comprising one of the devices in the thermal zone; and
make a thermal policy decision affecting at least the thermal condition of the third device in response to determining the second thermal influence amount.
13. A method, comprising:
a processor reading a thermal relationship table to determine a first thermal influence amount a first device has on a second device, wherein the first device and second device are located in a single thermal zone; and
a processor making a thermal policy decision affecting at least the thermal condition of the second device in response to determining the first thermal influence amount.
14. The method of claim 13 , wherein the first thermal influence amount the first device has on the second device further comprises:
an amount of temperature increase the second device experiences per additional Watt of thermal load the first device generates.