LED backlight device and LCD device

1. An LED backlight device comprising:

a first substrate having optical transparency and having a first surface and a second surface opposite to said first surface;

an LED thin-film fixed to said first surface of said first substrate, said LED thin-film being formed of epitaxially grown inorganic material layers as a P-N junction device;

an anode electrode and a cathode electrode formed on said LED thin-film;

an anode driver IC and a cathode driver IC for driving said LED thin-film to emit light;

an anode wiring formed on said first surface of said first substrate to electrically connect said anode driver IC and said anode electrode of said LED thin-film,

a cathode wiring formed on said first surface of said first substrate to electrically connect said cathode driver IC and said cathode electrode of said LED thin-film, and

a second substrate having optical transparency and having a function to diffuse incident light, said second substrate being provided so as to face said second surface of said first substrate.

2. The LED backlight device according to claim 1 , wherein said LED thin-film is fixed to said first surface of said first substrate by means of intermolecular force, and

wherein said LED thin-film includes an LED thin-film that emits red light having wavelength in a range from 620 nm to 710 nm, an LED thin-film that emits green light having wavelength in a range from 500 nm to 580 nm, and an LED thin-film that emits blue light having wavelength in a range from 450 to 500 nm.

3. The LED backlight device according to claim 1 , wherein said first surface of said first substrate is formed of an organic or inorganic insulation film, and is planarized.

4. The LED backlight device according to claim 1 , wherein said LED thin-film is obtained by epitaxially growing inorganic material layers as a P-N junction device on a sacrificial layer formed on a base material different from said first substrate, separating said inorganic material layers from said base material by removing said sacrificial material layers using etching, fixing said inorganic material layers to said first surface of said first substrate by means of intermolecular force, and etching said inorganic material layers.

5. The LED backlight device according to claim 1 , wherein a plurality of said LED thin-films are arranged in rows and columns at intervals on said first surface of said first substrate.

6. The LED backlight device according to claim 1 wherein said LED thin-film includes an LED thin-film that emits red light having wavelength in a range from 620 nm to 710 nm, an LED thin-film that emits green light having wavelength in a range from 500 nm to 580 nm, and an LED thin-film that emits blue light having wavelength in a range from 450 to 500 nm;

wherein said LED thin-films that respectively emit said red, green and blue lights constitute an LED group;

wherein said anode wiring electrically connects said anode driver IC and said anode electrode of an endmost LED thin-film of said LED group;

wherein said cathode wiring electrically connects said cathode driver IC and said cathode electrode of another endmost LED thin-film of said LED group, and

wherein an interconnection wiring is provided to electrically connect said LED thin-films of said LED group in series.

7. The LED backlight device according to claim 1 , further comprising:

a first protection film having insulating property formed on said first surface of said first substrate so as to cover said LED thin-film;

a reflection film formed on said first insulating protection film, and

a second protection film having insulating property formed so as to cover said reflection film.

8. The LED backlight device according to claim 1 , further comprising:

a protection film having insulating property formed on said first surface of said first substrate so as to cover said LED thin-film, and

a heat releasing plate disposed on said first surface of said first substrate via said insulating protection film.

9. An LCD device comprising:

said LED backlight device according to claim 1 , and

an LCD panel provided so as to face said LED backlight device.

10. An LED backlight device comprising:

a first substrate having a function to diffuse incident light, having optical transparency and having a first surface;

an LED thin-film fixed to said first surface of said first substrate, said LED thin-film being formed of epitaxially grown inorganic material layers as a P-N junction device;

an anode electrode and a cathode electrode formed on said LED thin-film;

an anode driver IC and a cathode driver IC for driving said LED thin-film to emit light;

an anode wiring formed on said first surface of said first substrate to electrically connect said anode driver IC and said anode electrode of said LED thin-film, and

a cathode wiring formed on said first surface of said first substrate to electrically connect said cathode driver IC and said cathode electrode of said LED thin-film.

11. The LED backlight device according to claim 10 , wherein said LED thin-film is fixed to said first surface of said first substrate by means of intermolecular force, and

wherein said LED thin-film includes an LED thin-film that emits red light having wavelength in a range from 620 nm to 710 nm, an LED thin-film that emits green light having wavelength in a range from 500 nm to 580 nm, and an LED thin-film that emits blue light having wavelength in a range from 450 to 500 nm.

12. The LED backlight device according to claim 10 , wherein said first surface of said first substrate is formed of an organic or inorganic insulation film, and is planarized.

13. The LED backlight device according to claim 10 , wherein said LED thin-film is obtained by epitaxially growing inorganic material layers as a P-N junction device on a sacrificial layer formed on a base material different from said first substrate, separating said inorganic material layers from said base material by removing said sacrificial material layers using etching, fixing said inorganic material layers to said first surface of said first substrate by means of intermolecular force, and etching said inorganic material layers.

14. The LED backlight device according to claim 10 , wherein a plurality of said LED thin-films are arranged in rows and columns at intervals on said first surface of said first substrate.

15. The LED backlight device according to claim 10 , wherein said LED thin-film includes an LED thin-film that emits red light having wavelength in a range from 620 nm to 710 nm, an LED thin-film that emits green light having wavelength in a range from 500 nm to 580 nm, and an LED thin-film that emits blue light having wavelength in a range from 450 to 500 nm;

wherein said LED thin-films that respectively emit said red, green and blue lights constitute an LED group;

wherein said anode wiring electrically connects said anode driver IC and said anode electrode of an endmost LED thin-film of said LED group;

wherein said cathode wiring electrically connects said cathode driver IC and said cathode electrode of another endmost LED thin-film of said LED group, and

wherein an interconnection wiring is provided to electrically connect said LED thin-films of said LED group in series.

16. The LED backlight device according to claim 10 , further comprising:

a first protection film having insulating property formed on said first surface of said first substrate so as to cover said LED thin-film;

a reflection film formed on said first insulating protection film, and

a second protection film having insulating property formed so as to cover said reflection film.

17. The LED backlight device according to claim 10 , further comprising:

a protection film having insulating property formed on said first surface of said first substrate so as to cover said LED thin-film, and

a heat releasing plate disposed on said first surface of said first substrate via said insulating protection film.

18. An LCD device comprising:

said LED backlight device according to claim 10 , and

an LCD panel provided so as to face said LED backlight device.

19. An LED backlight device comprising:

a first substrate having thermal conductivity and having a first surface;

an LED thin-film fixed to said first surface of said first substrate, said LED thin-film being formed of epitaxially grown inorganic material layers as a P-N junction device;

an anode electrode and a cathode electrode formed on said LED thin-film;

an anode driver IC and a cathode driver IC for driving said LED thin-film to emit light;

an anode wiring formed on said first surface of said first substrate to electrically connect said anode driver IC and said anode electrode of said LED thin-film,

a cathode wiring formed on said first surface of said first substrate to electrically connect said cathode driver IC and said cathode electrode of said LED thin-film, and

a second substrate having optical transparency and having a function to diffuse incident light, said second substrate being provided so as to face said first surface of said first substrate.

20. The LED backlight device according to claim 19 , wherein said LED thin-film is fixed to said first surface of said first substrate by means of intermolecular force, and

wherein said LED thin-film includes an LED thin-film that emits red light having wavelength in a range from 620 nm to 710 nm, an LED thin-film that emits green light having wavelength in a range from 500 nm to 580 nm, and an LED thin-film that emits blue light having wavelength in a range from 450 to 500 nm.

21. The LED backlight device according to claim 19 , wherein said first surface of said first substrate is formed of an organic or inorganic insulation film, and is planarized.

22. The LED backlight device according to claim 19 , wherein said LED thin-film is obtained by epitaxially growing inorganic material layers as a P-N junction device on a sacrificial layer formed on a base material different from said first substrate, separating said inorganic material layers from said base material by removing said sacrificial material layers using etching, fixing said inorganic material layers to said first surface of said first substrate by means of intermolecular force, and etching said inorganic material layers.

23. The LED backlight device according to claim 19 , wherein a plurality of said LED thin-films are arranged in rows and columns at intervals on said first surface of said first substrate.

24. The LED backlight device according to claim 19 , wherein said LED thin-film includes an LED thin-film that emits red light having wavelength in a range from 620 nm to 710 nm, an LED thin-film that emits green light having wavelength in a range from 500 nm to 580 nm, and an LED thin-film that emits blue light having wavelength in a range from 450 to 500 nm;

wherein said LED thin-films that respectively emit said red, green and blue lights constitute an LED group;

wherein said anode wiring electrically connects said anode driver IC and said anode electrode of an endmost LED thin-film of said LED group;

wherein said cathode wiring electrically connects said cathode driver IC and said cathode electrode of another endmost LED thin-film of said LED group, and

wherein an interconnection wiring is provided to electrically connect said LED thin-films of said LED group in series.

25. The LED backlight device according to claim 19 , further comprising:

a reflection film formed on said first surface of said first substrate,

an organic or inorganic insulation film formed so as to cover said reflection film and having a planarized surface to which said LED thin-film is fixed.

26. The LED backlight device according to claim 19 , further comprising a heat releasing plate provided on a second surface of said first substrate opposite to said first substrate.

27. An LCD device comprising:

said LED backlight device according to claim 19 , and

an LCD panel provided so as to face said LED backlight device.