Adapter board and method for manufacturing same, probe card, method for inspecting semiconductor wafer, and method for manufacturing semiconductor device
View Patent ↗An adapter board includes a package substrate having a first surface and a second surface and further including a board having wirings formed therein, pads disposed in the device side, and the pads disposed in the bump side, an insulating resin layer joined to the first surface, through holes formed in the positions corresponding to the pads in the insulating resin layer, vias formed in the through holes, and pads covering the through holes, wherein the pads are electrically coupled to the pads through the wirings, and the pads are electrically coupled to the pads through the vias.
1. An adapter board, comprising:
a package substrate, including a board body having a first surface and a second surface and also having a wiring formed in the interior thereof, a first land pad disposed on said first surface and a second land pad disposed on said second surface;
an insulating layer formed over said first surface of said package substrate;
a through hole formed in a position corresponding to said first land pad of said insulating layer;
a conductive member formed in said through hole;
a third land pad covering said through hole and having an exposed bump side without being covered with the insulating layer; and
an external coupling terminal formed in said second land pad,
wherein said first land pad is electrically coupled to said second land pad through said wiring, and
said third land pad is electrically coupled to said first land pad through said conductive member and the adapter board further includes a second testing-dedicated pad for applying electrical signal in said second surface, wherein said first land pad contains a first testing-dedicated pad, wherein said first testing-dedicated pad is electrically coupled to said second testing-dedicated pad through said wiring, and wherein an external coupling terminal is formed in said second testing-dedicated pad.
2. The adapter board as set forth in claim 1 , wherein said third land pad is covered with an electroconductive protective film.
3. The adapter board as set forth in claim 2 , wherein said electroconductive protective film is a gold-plated film.
4. The adapter board as set forth in claim 1 , wherein said third land pad is protruded over the surface of said insulating layer.
5. The adapter board as set forth in claim 1 , wherein the dimensional area of said third land pad is larger than the dimensional area of said first land pad.
6. The adapter board as set forth in claim 1 , wherein an inter-pad distance for said second land pads is larger than an inter-pad distance for said first land pads, and an inter-pad distance for said third land pads is equivalent to an inter-pad distance for said first land pads.
7. The adapter board as set forth in claim 1 , wherein the third land pad is disposed above the insulating layer.
8. The adapter board as set forth in claim 1 , wherein the third land pad is convex against the first surface of the package substrate.
9. The adapter board as set forth in claim 1 , wherein the insulating layer is formed on the package substrate without a resist.