Substrate processing method and substrate processing apparatus

1. A substrate processing method comprising:

generating mixed plasma by plasma discharge of a mixed gas of hydrogen gas and oxygen or oxygen-containing gas supplied to a processing chamber, and processing a substrate on a surface of which a polysilicon film and a metal film are exposed by said mixed plasma; and

generating hydrogen plasma by the plasma discharge of hydrogen gas supplied to the processing chamber, and processing said substrate by said hydrogen plasma,

wherein the processing said substrate by said hydrogen plasma is a first step, and the processing a substrate on a surface of which a polysilicon film and a metal film are exposed by said mixed plasma is a second step after said first step.

2. The substrate processing method of claim 1 , wherein when a process of the substrate by the first step and the second step is repeated, concentration of the oxygen gas remaining in the processing chamber in said first step, as a result of the preliminary substrate processing, is 11.1% or less.

3. The substrate processing method of claim 1 , wherein the oxygen gas or the oxygen-contained gas except for the hydrogen gas is provided to the processing chamber in the first step, and the flow ratio of oxygen gas in relation to said hydrogen gas in said first step is less than the flow ratio of oxygen gas in relation to said hydrogen gas in said second step.

4. The substrate processing method of claim 1 , wherein hydrogen gas is supplied in said first step, and the supply of said hydrogen gas is continued, and oxygen gas is supplied in addition to the hydrogen gas in said second step.

5. The substrate processing method of claim 1 , wherein the oxygen gas or the oxygen-containing gas except for the hydrogen gas is provided to the processing chamber in the first step, and the flow rate of oxygen gas contained in the gas in said first step is less than the flow rate of oxygen gas contained in said mixed gas in said second step.

6. The substrate processing method of claim 1 , wherein oxygen gas is not supplied in said first step.

7. The substrate processing method of claim 1 , wherein the step of performing a process with said mixed plasma is a third step, and the step of performing a process with said hydrogen plasma is performed as a fourth step after said third step.

8. The substrate processing method of claim 7 , wherein a concentration of the oxygen-containing gas remaining in the processing chamber in said fourth step as a result of the plasma processing in the third step is 11.1% or less.

9. The substrate processing method of claim 7 , wherein the substrate is selectively oxidized by said mixed plasma in the third step, and the supply of oxygen gas is stopped in said fourth step.

10. The substrate processing method of claim 7 , wherein the oxygen gas or the oxygen-containing gas except for the hydrogen gas is provided to the processing chamber in the first step, and a flow rate of oxygen gas contained in the gas in said fourth step is less than a flow rate of oxygen gas contained in said mixed gas in said third step.

11. The substrate processing method of claim 7 , wherein oxygen gas is not supplied in said fourth step.

12. A substrate processing method comprising:

generating mixed plasma by plasma discharge of a mixed gas of hydrogen gas and oxygen or oxygen-containing gas supplied to a processing chamber, and processing a substrate on a surface of which a polysilicon film and a metal film are exposed by said mixed plasma; and

generating hydrogen plasma by plasma discharge of hydrogen gas supplied to the processing chamber, and processing said substrate by said hydrogen plasma,

wherein the processing a substrate on a surface of which a polysilicon film and a metal film are exposed by said mixed plasma a is a third step, and the processing said substrate by said hydrogen plasma is a fourth step after said third step; and

the oxygen gas or the oxygen-containing gas except for the hydrogen gas is provided to the processing chamber in the fourth step, and

a flow ratio of oxygen gas in relation to said hydrogen gas in the fourth step is less than a flow ratio of oxygen gas in relation to said mixed gas in said third step.

13. A substrate processing apparatus including:

a processing chamber that processes a substrate on a surface of which a polysilicon film and a metal film are exposed;

a mixed gas inlet port that introduces a mixed gas of hydrogen gas and oxygen or oxygen-containing gas into said processing chamber;

a hydrogen gas inlet port that introduces hydrogen gas into said processing chamber;

an exhaust port that evacuates an interior of said processing chamber;

a plasma generating part that: i) generates mixed plasma by plasma discharge of said mixed gas of hydrogen gas and oxygen or oxygen-containing gas supplied to the processing chamber, and ii) generates a hydrogen plasma by the plasma discharge of hydrogen gas supplied to the processing chamber; and

a controller that performs control so that said mixed gas introduced through said mixed gas inlet port is caused to form said plasma discharge of said mixed gas of hydrogen gas and oxygen or oxygen-containing gas and is supplied to the substrate while exhausted through said exhaust port, and so that said hydrogen gas introduced through said hydrogen gas inlet port is caused to form said plasma discharge of hydrogen gas and is supplied to the substrate while exhausted through said exhaust port; wherein

the processing chamber processes said hydrogen plasma is a first step, and processes the substrate on a surface of which a polysilicon film and a metal film are exposed second step after said first step.

14. The substrate processing apparatus of claim 13 , wherein said

controller performs control so that said hydrogen gas introduced through said hydrogen gas inlet port is caused to form a plasma discharge and supplied to the substrate while exhausted through said exhaust port, and thereafter said mixed gas introduced through said mixed gas inlet port is caused to form a plasma discharge and supplied to the substrate while exhausted through said exhaust port.

15. The substrate processing apparatus of claim 13 , wherein

said controller performs control so that said mixed gasis caused to form a plasma discharge and supplied to the substrate while exhausted through said exhaust port, and thereafter said hydrogen gasis caused to form a plasma discharge and supplied to the substrate while exhausted through said exhaust port.