IP Library Granted Patent US 7,817,860
Granted Patent B2
US 7,817,860 · App. 12/326,544 · Granted Oct 19, 2010

Method and apparatus for measuring dimension using electron microscope

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Quick Facts
Patent No.
US 7,817,860
App. No.
12/326,544
Granted
Oct 19, 2010
Kind
B2
Abstract

Disclosed is a scanning electron microscope (SEM) for realizing high-precision dimension measurement of a sample, such as an ArF exposure photoresist, that requires the measurement of a dimension by a low S/N signal waveform. To this end, partial waveforms (or partial images) of sample signal waveforms (or an images) acquired from a dimension measurement target sample and a sample material of the same kind are registered in advance, a measurement target signal waveform (or an image) obtained from the dimension measurement target sample and the sample registration waveform are combined, and a dimension of the dimension measurement target pattern is calculated based on the combination result.

Claims (11)

1. An apparatus for measuring a dimension using electron rays comprising:

imaging means for imaging a surface of a sample material by radiating and scanning electron rays focused on the sample material and detecting secondary electrons or reflected electrons generated from the sample material;

a measurement recipe setup unit for storing a measurement recipe used for the imaging means;

sample registration waveform storage means for storing a partial waveform of a sample signal waveform as a sample registration waveform, in which the sample signal waveform is formed by a signal waveform formation means based on a sample pattern signal obtained by imaging a sample pattern formed on a sample material using the imaging means based on the measurement recipe set by the measurement recipe setup unit;

waveform combination means for combining a measurement target signal waveform formed by a signal waveform formed by a signal waveform formation means with the sample registration waveform stored in the sample registration waveform storage means, in which the measurement target signal waveform is formed based on a dimension measurement target signal obtained by imaging a dimension measurement target pattern formed on a dimension measurement target sample by using the imaging means based on the measurement recipe set by the measurement recipe setup unit; and

dimension calculation means for calculating a dimension of the dimension measurement target pattern based on the waveform combination result from the waveform combination means.

2. The apparatus of claim 1 , wherein the sample signal waveform includes a plurality of sample signal waveforms which are formed by line addition or smoothing on a sample hole pattern in a plurality of directions, the sample hole pattern being the sample pattern formed on the sample material.

3. The apparatus of claim 2 , wherein the measurement target signal waveform includes a plurality of measurement target signal waveform which are formed by line addition or smoothing on a dimension measurement target hole pattern in the plurality of directions, the dimension measurement target hole pattern being the dimension measurement target pattern.

4. The apparatus of claim 1 , wherein, in the dimension calculation means, the sample signal waveform to be combined with the measurement target signal waveform is a partial waveform at an approximate waveform calculated by filtering the sample signal waveform by the signal waveform formation means.

5. The apparatus of claim 1 , further comprising a display means for displaying the sample signal waveform.

6. The apparatus of claim 1 , wherein the measurement recipe describes coordinates of a measurement spot and a measurement condition used for imaging means.

Assignments (1)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →