Ultra-thin polymeric adhesion layer
View Patent ↗An imprint lithography imprinting stack includes a substrate and a polymeric adhesion layer adhered to the substrate. The polymeric adhesion layer includes polymeric components with an extended backbone length of at least about 2 nm. The backbones of the polymeric components may be substantially aligned in a planar configuration on the surface of the substrate, such that a thickness of the polymeric adhesion layer is less than about 2 nm.
1. An imprint lithography imprinting stack comprising:
a substrate;
a polymeric adhesion layer adhered to the substrate, wherein the polymeric adhesion layer is formed from a polymerizable composition comprising a polymeric component, the polymeric component comprising a repeating aromatic group, and wherein a thickness of the polymeric adhesion layer is less than about 2 nm.
2. The imprinting stack of claim 1 , wherein the thickness of the polymeric adhesion layer is about 1 nm.
3. The imprinting stack of claim 1 , wherein the polymeric component has an extended backbone length of at least about 2 nm.
4. The imprinting stack of claim 3 , wherein the polymeric component is synthesized from a cresol epoxy novolac.
5. The imprinting stack of claim 3 , wherein the polymeric component comprises a carboxyl group capable of bonding to the substrate and an additional functional group capable of bonding with an imprint resist.
6. The imprinting stack of claim 1 , wherein the polymeric adhesion layer is capable of bonding with an imprint resist during solidification of the imprint resist on the imprinting stack.
7. A method of forming an adhesion layer on an imprint lithography substrate, the method comprising:
spin-coating a polymerizable composition onto an imprint lithography substrate; and
solidifying the polymerizable composition to form a polymeric adhesion layer adhered to the imprint lithography substrate, wherein the polymerizable composition comprises a polymeric component, the polymeric component comprising a repeating aromatic group, and wherein a thickness of the polymeric adhesion layer is less than about 2 nm.
8. The method of claim 7 , wherein the thickness of the polymeric adhesion layer is about 1 nm.
9. The method of claim 7 , wherein the polymeric component has an extended backbone length of at least about 2 nm.
10. The method of claim 7 , wherein the polymeric component is synthesized from a cresol epoxy novolac.
11. The method of claim 7 , wherein the polymerizable composition comprises a polymeric component, and the polymeric component comprises a carboxyl group capable of bonding to the substrate and an additional functional group capable of bonding with an imprint resist.
12. The method of claim 7 , further comprising applying an imprint resist to the polymeric adhesion layer and solidifying the imprint resist, wherein solidifying the imprint resist comprises bonding the imprint resist to the polymeric adhesion layer.
13. An imprint lithography method comprising:
spin-coating a polymerizable composition on an imprint lithography substrate, wherein the polymerizable composition comprises polymeric components, each polymeric component comprising a repeating aromatic group and having an extended backbone length of at least about 2 nm;
substantially aligning the backbones of the polymeric components in a planar configuration on the surface of the imprint lithography substrate; and
solidifying the polymerizable composition to form a polymeric adhesion layer adhered to the imprint lithography substrate, wherein a thickness of the polymeric adhesion layer is less than about 2 nm.
14. The method of claim 13 , wherein the thickness of the polymeric adhesion layer is about 1 nm.
15. The method of claim 13 , wherein the polymeric component is synthesized from a cresol epoxy novolac.
16. The method of claim 13 , wherein the polymeric component comprises a carboxyl group capable of bonding to the substrate and an additional functional group capable of bonding with an imprint resist.
17. The method of claim 13 , wherein the polymeric adhesion layer is capable of bonding with an imprint resist during solidification of the imprint resist on the imprinting stack.