Printing shielded connections and circuits
An embodiment is a method and apparatus to construct a shielded cable, wire, or circuit. A first insulator layer is deposited on a first conductor or semiconductor layer. A second conductor or semiconductor layer is deposited on the first insulator layer. A second insulator layer is deposited on the first insulator layer. The second insulator layer covers the second conductor or semiconductor layer and defines a shielded region. A third conductor or semiconductor layer is deposited on the first conductor or semiconductor layer. The third conductor or semiconductor layer covers the first and second insulator layers. At least one of the first, second, and third conductor or semiconductor layers, and the first and second insulator layers is deposited by printing.
1. An apparatus comprising:
a first conductor or semiconductor layer;
a first insulator layer deposited on the first conductor or semiconductor layer;
a second conductor or semiconductor layer deposited on the first insulator layer;
a second insulator layer deposited on the first insulator layer and covering the second conductor or semiconductor layer, the second insulator layer defining a shielded region; and
a third conductor or semiconductor layer deposited on the first conductor or semiconductor layer and encapsulating the first and second insulator layers;
wherein at least one of the first, second, and third conductor or semiconductor layers, and the first and second insulator layers is deposited by printing, and
wherein one of the first and second conductor or semiconductor layers is a gate and the third conductor or semiconductor layer includes a source and drain of a transistor device.
2. The apparatus of claim 1 wherein the first conductor or semiconductor layer is a conductive substrate.
3. The apparatus of claim 1 wherein the first conductor or semiconductor layer is deposited on a substrate.
4. The apparatus of claim 1 wherein at least one of the first, second, and third conductor or semiconductor layers, and the first and second insulator layer is deposited by inkjet printing.
5. The apparatus of claim 1 wherein at least one of the first, second, and third conductor or semiconductor layers is made of a printed conductor.
6. The apparatus of claim 1 wherein at least one of the first and second insulator layers is made from one of printed polymer solutions, printed polymer particles, precursors for inorganic insulators, silicones, polysilsesquioxanes, inorganic particles, hybrid organic-inorganic insulators, and a piezoelectric polymer.
7. The apparatus of claim 6 wherein the printed conductor is made of one of polyacetylene, polyaniline, a polymer mixture of two ionomers, sintered metal nanoparticles, a metal precursor, carbon nanotubes, metal nanowires, and a printed seed material for plating.
8. The apparatus of claim 1 wherein the shielded region further comprises an active component.
9. The apparatus of claim 8 wherein the active component is an electrical component or an optical component.
10. The apparatus of claim 1 wherein at least one of the first and second insulator layers is a piezoelectric polymer.
11. The apparatus of claim 10 wherein at least one of the first and second insulation layers includes a curable polymer.
12. An apparatus comprising:
a first conductor or semiconductor layer;
a first insulator layer deposited on the first conductor or semiconductor layer;
a second conductor or semiconductor layer deposited on the first insulator layer;
a second insulator layer deposited on the first insulator layer and covering the second conductor or semiconductor layer, the second insulator layer defining a shielded region; and
a third conductor or semiconductor layer deposited on the first conductor or semiconductor layer and encapsulating the first and second insulator layers;
wherein at least one of the first, second, and third conductor or semiconductor layers, and the first and second insulator layers is deposited by printing
a fourth conductor or semiconductor layer deposited on the second insulator layer; and
a third insulator layer deposited on the second insulator layer and covering the fourth conductor or semiconductor layer, the third insulator layer being within the third conductor or semiconductor layer.
13. The apparatus of claim 1 further comprising:
a branch-connection to accommodate a shielded assembly.
14. A method comprising:
forming a first conductor or semiconductor layer;
depositing a first insulator layer on the first conductor or semiconductor layer;
depositing a second conductor or semiconductor layer on the first insulator layer;
depositing a second insulator layer on the first insulator layer, the second insulator layer covering the second conductor or semiconductor layer and defining a shielded region; and
depositing a third conductor or semiconductor layer on the first conductor or semiconductor layer, the third conductor or semiconductor layer encapsulating the first and second insulator layers;
wherein at least one of the first, second, and third conductor or semiconductor layers, and the first and second insulator layers is deposited by printing, and
wherein one of the first and second conductor or semiconductor layers is a gate and the third conductor or semiconductor layer includes a source and drain of a transistor device.
15. The method of claim 14 wherein the first conductor or semiconductor layer is a conductive substrate.
16. The method of claim 14 wherein the first conductor or semiconductor layer is deposited on a substrate.
17. The method of claim 14 wherein at least one of the first, second, and third conductor or semiconductor layers, and the first and second insulator layers is printed by inkjet printing.
18. The method of claim 14 wherein at least one of the first, second, and third conductor or semiconductor layers is made of a printed conductor.
19. The method of claim 18 wherein the printed conductor is made of one of polyacetylene, polyaniline, a polymer mixture of two ionomers, sintered metal nanoparticles, a metal precursor, carbon nanotubes, metal nanowires, and a printed and plated seed material.
20. The method of claim 14 wherein at least one of the first and second insulator layers is made from one of printed polymer solutions, printed polymer particles, precursors for inorganic insulators, silicones, polysilsesquioxanes, inorganic particles, hybrid organic-inorganic insulators, and a piezoelectric polymer.
21. The method of claim 14 further comprising forming an active component inside the shielded region.
22. A circuit comprising:
a sensor to generate a sensing signal;
an input circuit to read the sensing signal; and
a shielded cable connecting the sensor to the input circuit, the shielded cable comprising:
a first conductor or semiconductor layer,
a first insulator layer deposited on the first conductor or semiconductor layer,
a second conductor or semiconductor layer deposited on the first insulator layer,
a second insulator layer deposited on the first insulator layer and covering the second conductor or semiconductor layer, the second insulator layer defining a shielded region, and
a third conductor or semiconductor layer deposited on the first conductor or semiconductor layer and encapsulating the first and second insulator layers;
wherein at least one of the first, second, and third conductor or semiconductor layers, and the first and second insulator layers is deposited by printing, and
wherein one of the first and second conductor or semiconductor layers is a gate and the third conductor or semiconductor layer includes a source and drain of a transistor device.
23. The circuit of claim 22 wherein the first conductor or semiconductor layer is a conductive substrate.
24. The circuit of claim 22 wherein the first conductor or semiconductor layer is deposited on a substrate.