LIGHT EMITTING DIODE PACKAGE
A light emitting diode package for preventing an electric short circuit among semiconductor layers and with excellent bonding strength. The light emitting diode package includes a package substrate, a light emitting diode chip bonded to an upper surface of the package substrate, and a bonding material for bonding the light emitting diode chip to the package substrate. The package substrate has a recess formed in a bonding surface thereof to accommodate the bonding material.
1 - 18 . (canceled)
19 . A light emitting diode package comprising:
a package substrate;
a light emitting diode (LED) chip bonded to an upper surface of the package substrate; and
a bonding material for bonding the light emitting diode chip to the package substrate,
wherein the package substrate has a recess formed in a bonding surface thereof for accommodating the bonding material, wherein the LED chip comprises a horizontal-structure LED chip having an insulation substrate.
20 . The light emitting diode package according to claim 19 , wherein the insulation substrate is bonded to the bonding surface of the package substrate, and the bonding material comprises an epoxy resin.
21 . The light emitting diode package according to claim 20 , wherein the epoxy resin comprises an Ag epoxy resin.