Light-emitting diode
The outer peripheral portion of a substrate is provided with a first peripheral edge and a second peripheral edge. The first peripheral edge is provided on the edge portion of a first upper surface of the substrate on which a light-emitting diode element is mounted. The second peripheral edge is formed either on an extension of an imaginary line connecting an edge of the light-emitting facet of the light-emitting diode element and the first peripheral edge or inwardly of the extension. The second peripheral edge is located at a position where the first peripheral edge blocks direct light from the light-emitting diode element. This configuration prevents the second upper surface of the substrate provided between the first peripheral edge and the second peripheral edge from becoming deteriorated due to the direct light.
1. A light-emitting diode, comprising:
a substrate made of an insulating material and having an upper surface, the upper surface including:
a first upper surface having at least a pair of electrodes formed on the first upper surface,
a second upper surface provided adjacent to the first upper surface at a position lower than a height of the first upper surface,
a first peripheral edge being positioned between the first upper surface and the second upper surface, and
a second peripheral edge of the second upper surface being positioned outside the first peripheral edge when viewed from above;
at least one light-emitting diode element mounted on the first upper surface of the substrate and electrically connected to the electrodes formed on the first upper surface of the substrate;
a light-transmitting sealing resin provided on and in direct contact with the first upper surface and the second upper surface of the substrate to the second peripheral edge of the second upper surface to encapsulate all of the light-emitting diode element, the first upper surface, the first peripheral edge, and the second upper surface; and
the light-emitting diode element having a light-emitting facet, and the second peripheral edge being positioned inwardly of an extension of an imaginary line connecting an edge of the light-emitting facet and the first peripheral edge of the substrate.
2. A light-emitting diode, comprising:
a substrate made of an insulating material, the substrate having an upper surface, the upper surface including:
a first upper surface having at least a pair of electrodes formed on the first upper surface,
a second upper surface provided adjacent to the first upper surface at a position lower than a height of the first upper surface,
a first peripheral edge being positioned between the first upper surface and the second upper surface, and a second peripheral edge of the second upper surface being positioned outside the first peripheral edge when viewed from above;
at least one light-emitting diode element mounted on the first upper surface of the substrate and electrically connected to the electrodes formed on the first upper surface of the substrate;
a light-transmitting sealing resin provided on and in direct contact with the first upper surface and the second upper surface of the substrate to the second peripheral edge of the second upper surface to encapsulate all of the light-emitting diode element, the first upper surface, the first peripheral edge, and the second upper surface; and
the light-emitting diode element having a light-emitting facet, and the second peripheral edge being positioned on an extension of an imaginary line connecting an edge of the light-emitting facet and the first peripheral edge of the substrate.
3. The light-emitting diode according to claim 1 , the second upper surface of the substrate comprising a generally horizontal plane that constitutes a part of a shoulder portion formed between the first peripheral edge and the second peripheral edge of the substrate.
4. The light-emitting diode according to claim 2 , the second upper surface of the substrate comprising a generally horizontal plane that constitutes a part of a shoulder portion formed between the first peripheral edge and the second peripheral edge of the substrate.
5. The light-emitting diode according to claim 1 , the second upper surface of the substrate comprising an inclined plane positioned between the first peripheral edge and the second peripheral edge of the substrate, and the sealing resin is in contact with the inclined plane.
6. The light-emitting diode according to claim 2 , the second upper surface of the substrate comprising an inclined plane positioned between the first peripheral edge and the second peripheral edge of the substrate, and the sealing resin is in contact with the inclined plane.
7. The light-emitting diode according to claim 1 , the first peripheral edge of the substrate provided entirely on an outer peripheral portion of the first upper surface of the substrate, and the second peripheral edge of the substrate provided entirely on an outer peripheral portion of the second upper surface of the substrate.
8. The light-emitting diode according to claim 2 , the first peripheral edge of the substrate provided entirely on an outer peripheral portion of the first upper surface of the substrate, and the second peripheral edge of the substrate provided entirely on an outer peripheral portion of the second upper surface of the substrate.
9. The light-emitting diode according to claim 1 , the electrodes including through holes that vertically penetrate the substrate and are electrically connected to lower electrodes that are provided on a lower surface of the substrate.
10. The light-emitting diode according to claim 2 , the electrodes including through holes that vertically penetrate the substrate and are electrically connected to lower electrodes that are provided on a lower surface of the substrate.
11. The light-emitting diode according to claim 3 , wherein the shoulder portion of the substrate includes the substantially horizontal plane and a substantially vertical plane, and the light-transmitting sealing resin is in contact with the planes of the shoulder portion of the substrate.
12. The light-emitting diode according to claim 4 , wherein the shoulder portion of the substrate includes the substantially horizontal plane and a substantially vertical plane, and the light-transmitting sealing resin is in contact with the planes of the shoulder portion of the substrate.