Surface treatment of hydrophobic ferroelectric polymers for printing
An embodiment is a method and apparatus to treat surface of polymer for printing. Surface of a polymer having a surface energy modified for a time period to control a feature characteristic and/or provide a hysteresis behavior. A material is printed on the surface to form a circuit pattern having at least one of the controlled feature characteristic and the hysteresis behavior.
1. An apparatus comprising:
a dielectric layer made of a polymer having a surface with modified surface energy, the modified surface energy controlling a feature characteristic and/or providing a hysteresis behavior, the dielectric layer including a surface and a portion below the surface, the surface of the dielectric layer being made of the surface with the modified surface energy of the polymer and the portion below the surface of the dielectric layer being made of the polymer, the surface of the dielectric layer being either (i) more hydrophobic or (ii) less hydrophobic than the portion below the surface of the dielectric layer; and
a circuit pattern printed on the surface, the circuit pattern having at least one of the controlled feature characteristic and the hysteresis behavior.
2. The apparatus of claim 1 wherein the feature characteristic includes at least one of a feature size, a feature uniformity, a contact angle, and a line width.
3. The apparatus of claim 1 wherein the polymer is a hydrophobic polymer or a ferroelectric material.
4. The apparatus of claim 3 wherein the ferroelectric material is a Poly (Vinylidene Fluoride) (PVDF) co-polymer.
5. The apparatus of claim 1 wherein the circuit pattern comprises:
a conductor or a semiconductor, including metal nanoparticles, or a polymeric ink pattern.
6. The apparatus of claim 1 wherein the circuit pattern comprises:
a circuit including at least one of an active element and a passive element.
7. The apparatus of claim 6 wherein the circuit comprises:
a non-volatile memory cell.
8. The apparatus of claim 1 wherein the circuit pattern comprises one of:
a conductive trace, a capacitor electrode, a via hole interconnect, and a contact.
9. The apparatus of claim 8 , wherein the conductive trace has a uniform width and low resistance.