Silicone resin composition
View Patent ↗A silicone resin composition is provided, which includes polysiloxane including (PSA1), (PSA2), (PSB) and (PSC), and a hydrosilylating catalyst, wherein a weight ratio between (PSA2) and (PSA1) (w2/w1) is 0.03-0.2:
1. A silicone resin composition comprising:
a) a first silicone resin represented by the following general formula (A1) and incorporated at a first weight (w1);
wherein R 10 s may be the same or different and are individually selected from alkyl group having 1 to 4 carbon atoms; and k1 is a number satisfying 800≦k1<900;
b) a second silicone resin represented by the following general formula (A2) and incorporated at a second weight (w2);
wherein R 11 s may be the same or different and are individually selected from alkyl group having 1 to 4 carbon atoms; k2 is a number satisfying k1+100≦k2<1300; and w2 is a value satisfying 0.03≦w2/w1≦0.2;
c) an alkenyl-group-containing polysiloxane represented by the following formula (B):
wherein R 12 is alkenyl group; and R 13 is an alkyl group having 1 to 4 carbon atoms;
d) hydro-group-containing polysiloxane represented by the following average composition formula (C):
R 14 m SiO (4-m)/2 (SiO 2 ) (C)
wherein R 14 constituted by 0.1 to 95 mole % of a hydro group and the balance of an alkyl group having 1 to 4 carbon atoms; and m is an integer of 1 to 3; the hydro-group-containing polysiloxane having a weight average molecular weight of 100 to 10000 and including 10 to 50 mole % of Q unit represented by formula:
and
e) a hydrosilylating catalyst.
2. The composition according to claim 1 , wherein the alkyl group to be introduced into the R 10 s of the general formula (A1) is selected from methyl group and ethyl group.
3. The composition according to claim 1 , wherein the viscosity of the first polysiloxane is confined to 5,000 to 16,000 mPa·s.
4. The composition according to claim 1 , wherein the first polysiloxane is selected from the groups shown below:
5. The composition according to claim 1 , wherein the alkyl group to be introduced into the R 11 s of the general formula (A2) is selected from methyl group and ethyl group.
6. The composition according to claim 1 , wherein the viscosity of the second polysiloxane is confined to 18,000 to 40,000 mPa·s.
7. The composition according to claim 1 , wherein the second polysiloxane is selected from the groups shown below:
8. The composition according to claim 1 , wherein a total content of the first polysiloxane and the second polysiloxane is confined to the range of 40 to 80 wt % based on a total weight of the silicone resin composition.
9. The composition according to claim 1 , wherein a total content of the first polysiloxane and the second polysiloxane is confined to the range of 50 to 75 wt % based on a total weight of the silicone resin composition.
10. The composition according to claim 1 , wherein a ratio between w2 and w1 (w2/w1) is 0.04-0.18.
11. The composition according to claim 1 , wherein the alkenyl group to be introduced into the R 12 of the general formula (B) is selected from the group consisting of vinyl group, allyl group, butenyl group and pentenyl group.
12. The composition according to claim 1 , wherein the alkyl group to be introduced into the R 13 s of the general formula (B) is methyl group.
13. The composition according to claim 1 , wherein the alkenyl group to be introduced into the R 12 of the general formula (B) is vinyl group.
14. The composition according to claim 1 , wherein the alkenyl-group-containing polysiloxane is selected from the groups shown below:
15. The composition according to claim 1 , wherein the alkenyl-group-containing polysiloxane is contained at a content of 10-40 wt % of the composition.
16. The composition according to claim 1 , wherein the alkyl group to be introduced into the R 14 of the average composition formula (C) is methyl group.
17. The composition according to claim 1 , wherein the hydro-group-containing polysiloxane has a weight average molecular weight ranging from 200 to 5,000.
18. The composition according to claim 1 , wherein the average composition formula (C) contains 0.1 to 10 wt % of trimethoxysilyl group.
19. The composition according to claim 1 , further comprising at least one selected from the group consisting of chain silicone resin, cyclic silicone resin and cage silicone resin.
20. A resin-encapsulated semiconductor device comprising:
a light-emitting element; and
a resin layer sealing the light-emitting element and formed of a cured material of the silicon resin composition claimed in claim 1 .