HEAD SUSPENSION AND DISK DEVICE

1 . A head suspension comprising:

a gimbal mounting a head slider;

gimbal supports supporting the gimbal; and

vibration sensors, each of vibration sensors arranged at each side of a centerline of the head slider along a longitudinal direction of the head suspension.

2 . The head suspension as set forth in claim 1 , wherein each of the vibration sensors are placed on each gimbal support.

3 . The head suspension as set forth in claim 1 , further comprising traces having a wiring pattern, wherein each of the vibration sensors are placed on a part of each of the traces at outer sides of the gimbal.

4 . The head suspension as set forth in claim 1 , wherein the output signals from the vibration sensors are input to a differential amplifier.

5 . The head suspension as set forth in claim 4 , wherein

first electrodes of the vibration sensors are connected to each other, and

second electrodes of the vibration sensors are connected to input terminals of the differential amplifier.

6 . The head suspension as set forth in claim 1 , wherein the vibration sensors are piezoelectric sensors.

7 . The head suspension as set forth in claim 1 or 2 , wherein the vibration sensors are strain gauges.

8 . A disk device comprising:

a head reading/writing data from and to a disk medium;

a head slider supporting the head;

a head suspension having a gimbal mounting the head slider;

gimbal supports supporting the gimbal;

traces having a wirings pattern;

a carriage arm supporting the head suspension;

vibration sensors, each of the vibration sensors arranged at each side of a centerline of the head slider along a longitudinal direction of the head suspension;

a signal processing circuit processing output signals from the vibration sensors so as to remove up/down vibration components.

9 . The disk device as set forth in claim 8 , wherein the signal processing circuit has a differential amplifier outputting a difference of the output signals from the vibration sensors.

10 . The disk device as set forth in claim 8 , wherein each of the vibration sensors is placed on each gimbal support.

11 . The disk device as set forth in claim 8 , wherein each of the vibration sensors are placed on a part of each of the traces at outer sides of the gimbal.

12 . The disk device as set forth in claim 8 , wherein

first electrodes of the vibration sensors are mutually connected, and

second electrodes of the vibration sensors are connected to the signal processing circuit.

13 . The disk device as set forth in claim 8 , wherein the vibration sensors are piezoelectric sensors.

14 . The disk device as set forth in claim 8 , wherein the vibration sensors are strain gauges.