Template pattern density doubling
View Patent ↗A sub-master template is patterned to provide at least double the density of features of a master template. The sub-master template and master template may employ the use of alignment marks during the patterning process.
1. A method of patterning a multi-layered substrate, the method comprising:
patterning, using a first template, the multi-layered substrate to provide at least one first protrusion and at least one first recession;
depositing one or more additional layers on the multi-layered substrate, and,
patterning, using the first template, the multi-layered substrate to remove portions of the first protrusions, the removal of portions of the first protrusions providing one or more additional protrusions;
wherein removal of portions of the first protrusions creates a sub-master template having at least double pattern density as compared to the first template.
2. The method of claim 1 , wherein patterning using the first template comprises:
forming, by the first template, a first patterned layer on the multi-layered substrate, the first patterned layer having at least one second protrusion and at least one second recession;
positioning, on the first patterned layer, a first conformal layer, the first conformal layer providing a first crown surface on at least a portion of the multi-layered substrate; and,
selectively removing portions of the multi-layered substrate to expose regions of the multi-layered substrate in superimposition with the second protrusion while forming a first hard mask in areas of the first crown surface in superimposition with the second recession.
3. The method of claim 2 , wherein forming the first patterned layer on the multi-layered substrate further comprises:
disposing on the multi-layer substrate a polymerizable fluid composition;
contacting, by the first template, the polymerizable fluid composition; and,
subjecting the polymerizable fluid composition to conditions to polymerize the polymerizable fluid composition.
4. The method of claim 3 , wherein the first template is an imprint lithography template.
5. The method of claim 1 , wherein patterning the multi-layered substrate to remove portions of the first protrusion comprises:
forming, by the first template, a first patterned layer on the multi-layered substrate, the first patterned layer having at least one second protrusion in superimposition with the first protrusion;
positioning, on the first patterned layer, a first conformal layer, the first conformal layer providing a first crown surface on at least a portion of the multi-layered substrate; and,
selectively removing portions of the multi-layered substrate to expose regions of the multi-layered substrate in superimposition with the second protrusion while forming a first hard mask in areas of the crown surface in superimposition with the second recession.
6. The method of claim 5 , wherein forming the first patterned layer on the multi-layered substrate further comprises:
disposing on the multi-layer substrate a polymerizable fluid composition;
contacting, by the first template, the polymerizable fluid composition; and,
subjecting the polymerizable fluid composition to conditions to polymerize the polymerizable fluid composition.
7. The method of claim 6 , wherein the first template is an imprint lithography template.
8. The method of claim 5 , wherein a width of the first protrusion is less than a width of the second protrusion.
9. The method of claim 5 , wherein a center of the first protrusion is substantially aligned with a center of the second protrusion.
10. The method of claim 5 , wherein the second protrusion and the second recession are trim etched prior to positioning the first conformal layer.