PROTECTIVE THIN FILM COATING IN CHIP PACKAGING

1 . A method of packaging a microelectronic die, comprising:

attaching a first side of the die to a first side of a package substrate;

forming a substantially conformal dielectric thin film over a second side of the die and over the first side of the package substrate; and

applying a molding compound over the substantially conformal dielectric thin film coating.

2 . The method as in claim 1 , further comprising:

bonding wires from the second side of the die to the first side of the package substrate before forming the substantially conformal dielectric thin film coating;

encasing the bonded wires in the substantially conformal dielectric thin film coating when the coating is formed over the die;

attaching solder balls to a second side of the package substrate after applying the molding compound; and

singulating the package substrate after attaching the solder balls.

3 . The method as in claim 1 , further comprising:

underfilling a region between the first side of the die and the first side of the package substrate before forming the substantially conformal dielectric thin film coating;

encasing the underfill in the substantially conformal dielectric thin film coating when the coating is formed over the die;

attaching solder balls to a second side of the package substrate after applying the molding compound; and

singulating the package substrate after attaching the solder balls.

4 . The method as in claim 1 , wherein forming the substantially conformal dielectric thin film coating further comprises conformally depositing, with vapor phase deposition process performed at approximately 25° C., a film to a thickness of between 10 nm and 300 nm.

5 . The method as in claim 4 , wherein a poly(para-xylene) is deposited with a sub-atmospheric chemical vapor deposition (CVD) process.

6 . The method as in claim 4 , wherein a material comprising primarily alumina is deposited with an atomic layer deposition (ALD) process.

7 . The method as in claim 4 , wherein at least one of a polyimide, a polyalkene, or BCB is deposited with a sub-atmospheric chemical vapor deposition (CVD) process.

8 . The method as in claim 1 , wherein forming the conformal dielectric thin film coating further comprises:

spraying an epoxy, a room temperature vulcanized (RTV) silicone, a fluorinated silicone, a fluorinated acrylic or a polyurethane.

9 . The method as in claim 8 , wherein the spraying is an aerosol deposition process forming the conformal dielectric thin film coating to a thickness of between 1 μm and 10 μm.

10 . A method of packaging a memory chip, comprising:

attaching, with a first die attach material, a first memory chip to a first side of a package substrate;

bonding a first wire from a first bond pad on the first memory chip to a second bond pad on the first side of the package substrate;

attaching, with a second die attach material, a second memory chip to the first memory chip;

bonding a second wire from a third bond pad on the second memory chip to a fourth bond pad on the first side of the package substrate;

forming a substantially conformal dielectric thin film coating over both the first and second memory chip stack, adjacent to the first and second die attach materials, over the second and fourth bond pad, and encasing the first and second bonded wires;

applying a molding compound over the substantially conformal dielectric thin film coating to surround the substantially conformal dielectric thin film encasing the first and second bonding wires.

11 . The method as in claim 10 , wherein forming the substantially conformal dielectric thin film coating further comprises vapor phase deposition of a poly(para-xylene) or alumina to a thickness of approximately 10 nm to 300 nm.

12 - 20 . (canceled)