Insulating film, printed circuit board substrate and printed circuit board including same
An insulating film includes a first polymer layer, a second polymer layer and an electromagnetic shielding layer sandwiched between the first polymer layer and the second polymer layer. The electromagnetic shielding layer includes a number of carbon nanotube films that are substantially parallel to the first and second polymer layer. Each of the carbon nanotube films includes a number of carbon nanotubes that are substantially parallel to each other. The insulating film can provide anti-EMI effect in printed circuit boards without employing additional electromagnetic shielding layers.
1. An insulating film, comprising:
a first polymer layer;
a second polymer layer; and
an electromagnetic shielding layer sandwiched between the first polymer layer and the second polymer layer; the electromagnetic shielding layer comprising a plurality of carbon nanotube films stacked one on another, the carbon nanotube films being substantially parallel to the first and second polymer layers, each of the carbon nanotube films comprising a plurality of carbon nanotubes which are connected end to end and substantially parallel to each other;
wherein the electromagnetic shielding layer includes m layers of the carbon nanotube films, m represents a natural number greater than two, the carbon nanotubes in the nth layer of the m layers of the carbon nanotube films are oriented an angle of (n−1)*θ relative to the carbon nanotubes in the first layer of the carbon nanotube films which is proximate to the second polymer layer, n represents a natural number between 2 to m, θ represents an angle between 0 to 90 degrees.
2. A printed circuit board substrate, comprising:
an insulating film comprising a first polymer layer, a second polymer layer and an electromagnetic shielding layer sandwiched between the first polymer layer and the second polymer layer, the electromagnetic shielding layer comprising a plurality of carbon nanotube films stacked one on another, the carbon nanotube films being substantially parallel to the first and second polymer layer, each of the carbon nanotube films comprising a plurality of carbon nanotubes which are connected end to end and substantially parallel to each other; and
a metallic layer formed on the insulating film;
wherein the electromagnetic shielding layer comprising m layers of the carbon nanotube films, m represents a natural number greater than two, the carbon nanotubes in the nth layer of the m layers of the carbon nanotube films are at an angle (n−1)*θ with the carbon nanotubes in the first carbon nanotube film in the m layers of the carbon nanotube films, n represents a natural number between 2 to m, θ represents an angle between 0 to 90 degrees.
3. A printed circuit board, comprising:
an insulating film comprising a first polymer layer, a second polymer layer and an electromagnetic shielding layer sandwiched between the first polymer layer and the second polymer layer, the electromagnetic shielding layer comprising a plurality of carbon nanotube films stacked one on another, the carbon nanotube films being substantially parallel to the first and second polymer layer, each of the carbon nanotube films comprising a plurality of carbon nanotubes which are connected end to end and substantially parallel to each other; and
a metallic layer formed on the insulating film, the metallic layer including a plurality of electrically conductive traces;
wherein the electromagnetic shielding layer comprising m layers of the carbon nanotube films, m represents a natural number greater than two, the carbon nanotubes in the nth layer of the m layers of the carbon nanotube films are at an angle (n−1)*θ with the carbon nanotubes in the first carbon nanotube film in the m layers of the carbon nanotube films, n represents a natural number between 2 to m, θ represents an angle between 0 to 90 degrees.
4. The insulating film of claim 1 , wherein the first polymer is made of a flexible material selected from the group consisting of polyimide, polytetrafluoroethylene, and polycarbonate.
5. The insulating film of claim 4 , wherein the second polymer is made of a flexible material selected from the group consisting of polyimide, polytetrafluoroethylene, and polycarbonate.
6. The insulating film of claim 1 , wherein the first polymer is made of epoxy polymer.
7. The insulating film of claim 6 , wherein the second polymer is made of epoxy polymer.
8. The insulating film of claim 1 , wherein the angle θ is in a range from about 0 degrees to about 60 degrees.
9. The printed circuit board substrate of claim 2 , wherein the first polymer is made of a flexible material selected from the group consisting of polyimide, polytetrafluoroethylene, and polycarbonate.
10. The printed circuit board substrate of claim 9 , wherein the second polymer is made of a flexible material selected from the group consisting of polyimide, polytetrafluoroethylene, and polycarbonate.
11. The printed circuit board substrate of claim 2 , wherein the first polymer is made of epoxy polymer.
12. The printed circuit board substrate of claim 11 , wherein the second polymer is made of epoxy polymer.
13. The printed circuit board substrate of claim 2 , wherein the angle θ is in a range from about 0 degrees to about 60 degrees.
14. The printed circuit board of claim 3 , wherein the first polymer is made of a flexible material selected from the group consisting of polyimide, polytetrafluoroethylene, and polycarbonate.
15. The printed circuit board of claim 14 , wherein the second polymer is made of a flexible material selected from the group consisting of polyimide, polytetrafluoroethylene, and polycarbonate.
16. The printed circuit board of claim 3 , wherein the first polymer is made of epoxy polymer.
17. The printed circuit board of claim 16 , wherein the second polymer is made of epoxy polymer.
18. The printed circuit board of claim 3 , wherein the angle θ is in a range from about 0 degrees to about 60 degrees.