Voltage non-uniformity compensation method for high frequency plasma reactor for the treatment of rectangular large area substrates
View Patent ↗A vacuum vessel and at least two electrodes define an internal process space. At least one power supply is connectable with the electrodes. A substrate holder holds a substrate to be treated in the internal process space. At least one of the electrodes has along a first cross section a concave profile and has along a second cross section a convex profile, the first cross section being parallel to the second cross section. Gas is provided to the space through a gas inlet. Power is provided to the electrodes and the substrate is treated.
1. A method for treating at least one flat substrate in a vacuum treatment apparatus, comprising the steps of:
introducing said substrate in an internal process space defined between at least two electrodes, one of which being an electrode having a surface with peripheral edges that define a rectangular or square shape when viewed from above, said surface having a generally convex profile along a respective edge cross section taken along each said peripheral edge, which profile gradually changes on approaching the center of said electrode to become a concave profile along a center cross section that is parallel to the respective edge cross section and is taken through the center of said surface,
providing gas to the internal process space via gas inlet means,
applying power to the internal process space via said electrodes, and
treating said substrate.
2. A method according to claim 1 , wherein treatment comprises one of heating, coating or etching.
3. A method according to claim 1 , wherein the substrate comprises one of a glass substrate, a flat panel display, a semiconductor substrate.