Method of manufacturing a conductor circuit, and a coil sheet and laminated coil

1. A method of manufacturing a conductor circuit comprising:

forming a continuous conductor pattern on an insulating substrate;

connecting a short-circuit wire at a first position on the continuous conductor pattern such that two or more points on the continuous conductor pattern are short-circuited to each other by the short-circuit wire at the first position;

forming an electrolytic plating film on the continuous conductor pattern while the short-circuit wire is connected to the continuous conductor pattern at the first position;

removing the short-circuit wire from the first position on the continuous conductor pattern to uncover a first exposed portion of the of the continuous conductor pattern;

after removing the short-circuit wire from the first position, connecting a short-circuit wire at a second position on the continuous conductor pattern such that two or more different points on the continuous conductor pattern are short-circuited to each other by the short-circuit wire at the second position;

forming an electrolytic plating film on at least part of said first exposed portion of the continuous conductor pattern while the short-circuit wire is connected to the continuous conductor pattern at said second position; and

removing the short-circuit wire from the second position on the continuous conductor pattern to uncover a second exposed portion of the of the continuous conductor pattern.

2. The method according to claim 1 , wherein said forming an electrolytic plating comprises applying an electrical potential to the continuous conductor pattern via the short-circuit wire.

3. The method according to claim 1 , wherein said connecting comprises connecting a short-circuit wire comprising an insulator and a lead wire.

4. The method according to claim 3 , wherein said connecting comprises connecting a short-circuit wire comprising an insulator having elasticity and conductive particles dispersed throughout the insulator.

5. The method according to claim 1 , wherein said connecting comprises pressing the short-circuit wire on the conductor pattern.

6. The method according to claim 1 , wherein:

said connecting comprises connecting a short-circuit wire comprising a metallic wire, and

said removing comprises removing the metallic wire between the two or more points on the conductor portion.

7. The method according to claim 6 , wherein the metallic wire comprises metal in the electrolytic plating film.

8. The method according to claim 1 , wherein said forming a continuous conductor pattern comprises forming the conductor pattern in a spiral on an insulating substrate.

9. The method according to claim 1 , further comprising:

connecting a short-circuit wire at another position on the continuous conductor pattern different from other positions to which a short-circuit wire was previously connected such that two or more other points on the continuous conductor pattern are short-circuited to each other by the short-circuit wire at the another position;

forming an electrolytic plating film on at least part of other exposed portions of the continuous conductor pattern to which a short circuit wire was previously connected and removed, while the short-circuit wire is connected to the continuous conductor pattern at said another position; and

removing the short-circuit wire from the another position on the continuous conductor pattern to uncover another exposed portion of the of the continuous conductor pattern.

10. The method according to claim 1 , further comprising planarizing the continuous conductor pattern to provide a substantially equal thickness along the entire length of the continuous conductor pattern.

11. The method according to claim 1 , further comprising forming the electrolytic plating film on the continuous conductor pattern while plating is repeated by displacing a portion that is in contact with the short-circuit wire comprising an insulator and a lead wire.