Surface inspection tool and surface inspection method
View Patent ↗An object of the present invention is to provide a surface inspection tool in which a flat inspection range capable of measuring surface roughness of a wafer with patterns with high accuracy and in a nondestructive manner can be searched without visual search. In order to solve the object, in a surface inspection tool 110 which measures scattering light intensity of scattering light generated by irradiated irradiation light in association with a measurement coordinate on a wafer 200 with patterns and inspects the surface roughness of the wafer 200 , the surface inspection tool includes a controller 250 which extracts measurement coordinate of the measured scattering light intensity that is equal to or more than a lower limit threshold L, sets an inspection range 406 of the surface roughness inspection in a partial layout 405 a of a part of the whole layout 401 of the pattern corresponding to the periphery of the extracted measurement coordinate, and obtains the surface roughness in the inspection range 406.
1. A surface inspection tool which measures scattering light intensity of scattering light generated by irradiated irradiation light in association with a measurement coordinate on a wafer with patterns and inspects surface roughness of the wafer, the surface inspection tool comprising:
a controller which
extracts the measurement coordinate of a location where the measured scattering light intensity is equal to or more than a lower limit threshold,
sets an inspection range of the surface roughness inspection in a partial layout of a part of the whole layout of the pattern corresponding to the periphery of the extracted measurement coordinate, and
obtains the surface roughness in the inspection range.
2. The surface inspection tool according to claim 1 , further comprising:
setting means which performs list display of both the scattering light intensity of the extracted measurement coordinate and the partial layout in a screen, and has the inspection range set from the list-displayed partial layout.
3. The surface inspection tool according to claim 1 , further comprising:
setting means which performs screen display of the partial layout of the extracted measurement coordinate, and has the inspection range set in the partial layout.
4. The surface inspection tool according to claim 1 , further comprising:
setting means which performs screen display of a histogram of the scattering light intensity with respect to the measurement coordinate, and persuades to set the lower limit threshold.
5. The surface inspection tool according to claim 1 , wherein
the controller extracts the measurement coordinate of the scattering light intensity that is equal to or less than an upper limit threshold which excludes the scattering light intensity caused by a foreign particle.
6. The surface inspection tool according to claim 5 , further comprising:
setting means which performs screen display of a histogram of the scattering light intensity with respect to the measurement coordinate, and persuades to set the upper limit threshold.
7. The surface inspection tool according to claim 1 , wherein
the controller performs screen display of the distribution of the scattering light intensity with respect to the measurement coordinate by a contour chart.
8. The surface inspection tool according to claim 7 , wherein
the controller displays the whole layout while juxtaposing with or superimposing on the contour chart.
9. The surface inspection tool according to claim 7 , wherein
the controller performs screen display of the extracted measurement coordinate in the corresponding coordinate as dot on the contour chart.
10. The surface inspection tool according to claim 7 , wherein
the controller performs screen display of the extracted measurement coordinate in the corresponding coordinate as dot on the whole layout.
11. The surface inspection tool according to claim 1 , wherein
the pattern is a pattern of the semiconductor device, and
the whole layout is a layout for one chip of the semiconductor device.
12. The surface inspection tool according to claim 1 , wherein
the controller measures the scattering light intensity of the measurement coordinate which belongs to the inspection range after setting the inspection range.
13. A surface inspection method which measures scattering light intensity of scattering light generated by irradiated irradiation light in association with a measurement coordinate on a wafer with patterns and inspects surface roughness of the wafer, the surface inspection method comprising the steps of:
extracting the measurement coordinate of a location where the measured scattering light intensity is equal to or more than a lower limit threshold,
setting an inspection range of the surface roughness inspection in a partial layout of a part of the whole layout of the pattern corresponding to the periphery of the extracted measurement coordinate, and
obtaining the surface roughness in the inspection range.