Multilayer ceramic electronic component including external electrodes that include a plating layer having a low film stress
A multilayer ceramic electronic component includes a laminate including a stack of a plurality of ceramic layers and a plurality of internal electrodes extending along interfaces between the ceramic layers, and a plurality of external electrodes electrically connecting the internal electrodes exposed at surfaces of the laminate. Each external electrode includes a plating layer at least at the portion directly connected to the internal electrodes. The plating layer has a compressive film stress of about 100 MPa or less or a tensile film stress of about 100 MPa or less.
1. A multilayer ceramic electronic component comprising:
a laminate including a stack of a plurality of ceramic layers, and a plurality of internal electrodes extending along interfaces between the plurality of ceramic layers and exposed at surfaces of the laminate; and
a plurality of external electrodes electrically connecting the internal electrodes at the surfaces at which the internal electrodes are exposed; wherein
each of the plurality of external electrodes includes a first plating layer at least at the portion directly connected to the internal electrodes; and
the first plating layer has a compressive film stress of about 100 MPa or less or a tensile film stress of about 100 MPa or less.
2. The multilayer ceramic electronic component according to claim 1 , wherein the first plating layer primarily includes Ni or Cu.
3. The multilayer ceramic electronic component according to claim 2 , wherein the first plating layer is defined by an electroplated layer.
4. The multilayer ceramic electronic component according to claim 1 , wherein the external electrode further includes another plating layer on the first plating layer.