ANGLED FLYING LEAD WIRE BONDING PROCESS
A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.
1 . A structure comprising flying lead wire structures attached to an electronic circuit component comprising:
said flying lead wire structures are bonded to a first surface of said electronic circuit component;
said wire structures comprise a desired shape in said flying lead wire;
said wire structure not being linear and perpendicular to said first surface; and
said flying lead wire structures having wire tip ends comprising a shear blade cut end.
2 . A structure according to claim 1 , further including said flying lead wires comprise a plurality of angles relative to the surface of said electronic circuit component.
3 . A structure according to claim 2 , said flying lead wires comprise a plurality of heights relative to the surface of said electronic circuit component.
4 . A structure according to claim 3 , further including said flying lead wires comprise a shape selected from the group consisting of linear, piece wise linear, continuously curved, and combinations thereof.
5 . A structure comprising flying lead wire structures attached to an electronic circuit component comprising:
said flying lead wire structures are bonded to a first surface of said electronic circuit component;
said flying lead wire structures comprise a desired shape in said flying lead wire structures; and wire tip ends comprising
a small nick on opposite sides of said wires.
6 . A structure according to claim 5 , further including said flying lead wires comprise a plurality of angles relative to the surface of said electronic circuit component.
7 . A structure according to claim 6 , further including said flying lead wires comprise a plurality of heights relative to the surface of said electronic circuit component.
8 . A structure according to any one of claims 1 or 5 , further including said flying lead wires further comprise disposed in a predetermined position a sheet of material having a plurality of openings therein through which said flying lead wires project.
9 . A structure according to claim 8 , further including a compliant frame structure, wherein a compliant frame structure is used to support said sheet of material.
10 . A structure according to claim 8 , wherein said sheet is spaced apart from said first surface of said electronic component by a flexible support.
11 . A structure according to claim 8 , wherein said sheet is spaced apart from said surface of the electronic component by a rigid support, said rigid support serves as a stand-off, or hard stop, to limit the degree of movement of said wire tip ends in a direction perpendicular to said surface.
12 . A structure according to claim 8 , wherein said sheet is spaced apart from said first surface of the electronic component by a support with a composite structure of both a rigid and a compliant layer.
13 . A structure according to claim 10 , wherein a space between said surface of the electronic component and said sheet is filled with a compliant medium.
14 . A structure according to claim 13 , wherein said the compliant medium is an elastomeric material.
15 . A structure according to claim 13 , wherein said the compliant medium is a foamed polymer material.
16 . A structure according to claim 10 , wherein said flexible support is selected from the group consisting of a spring and an elastomeric material.
17 . A structure according to claim 8 , wherein said wire tip ends comprise a structure selected from the group consisting of a protuberance, a spherical contact geometry, a straight contact end, a sharp spike, multiple sharp spike, sharp nodules and the combination of the above.
18 . A structure according to claim 8 , wherein said wire end tips are coated with a material selected from the group consisting of Ir, Pd, Pt, Ni, Au, Rh, Ru, Re, Co, Cu, and their alloys.
19 . A structure according to claim 8 , wherein said angle flying lead wire is coated with a material selected from the group consisting of Ir, Pd, Pt, Ni, Au, Rh, Ru, Re, Co, Cu, and their alloys.
20 . A structure according to claim 8 , wherein said sheet comprises materials selected from the group consisting of Invar laminate, a Cu/Invar/Cu laminate and molybdenum laminate.
21 . A structure according to claim 8 , wherein said sheet comprises a material selected from the group consisting of a metal, a polymer, a semiconductor and a dielectric.
22 . A structure according to claim 20 , wherein said the sheet is over-coated with a polymer layer.
23 . A structure according to claim 20 , wherein the sheet is overcoated with an insulating layer.
24 . A structure according to claim 20 , wherein the sheet is overcoated with a thin compliant polymer layer.
25 . A structure according to claim 20 , wherein the sheet is laminated between two insulating layers.
26 . A structure according to claim 8 further comprising:
a means for holding said electronic circuit, means for retractably moving said electronic circuit towards and away from said electronic device so that said wire tip ends contact electrical contact locations on said electronic device, and means for applying electrical signals to said elongated electrical conductors.
27 . A structure according to claim 1 , wherein said electronic circuit component is a substrate having an electrical conductor pattern.
28 . A structure according to claim 1 , wherein said flying lead wire structures further comprise a coating.
29 . A structure according to claim 5 , wherein said flying lead wire structures further comprise a coating.
30 . A structure according to claim 28 , wherein said coating is selected from the group consisting of Ir, Pd, Pt, Ni, Au, Rh, Ru, Re, Co, Cu and alloys thereof.
31 . A structure according to claim 29 , wherein said coating is selected from the group consisting of Ir, Pd, Pt, Ni, Au, Rh, Ru, Re, Co, Cu alloys thereof.