Piezoelectric thin film device
A piezoelectric thin film device according to the present invention comprises a lower electrode, a piezoelectric thin film and an upper electrode, in which the piezoelectric thin film is formed of an alkali niobium oxide-based perovskite material expressed by (K 1-x Na x )NbO 3 (0<x<1), and in which dependency of the piezoelectric constant d 31 of the piezoelectric thin film on applied electric field [=|(d 31 under 70 kV/cm)−(d 31 under 7 kV/cm)|/|d 31 under 70 kV/cm|] is 0.20 or less.
1. A piezoelectric thin film device, comprising: a lower electrode, a piezoelectric thin film and an upper electrode, wherein:
the piezoelectric thin film is formed of an alkali niobium oxide-based perovskite material expressed by (K 1-x Na x )NbO 3 (0<x<1), and wherein:
dependency of the piezoelectric constant d 31 of the piezoelectric thin film on applied electric field [=|(d 31 under 70 kV/cm)−(d 31 under 7 kV/cm)|/|d 31 under 70 kV/cm|] is 0.20 or less.
2. The piezoelectric thin film device according to claim 1 , wherein:
the piezoelectric thin film has a strong (001) KNN plane diffraction peak which occupies 80% or more of diffraction peaks of the piezoelectric thin film in an X-ray diffraction 2θ/θ measurement to a surface of the piezoelectric thin film.
3. The piezoelectric thin film device according to claim 1 , wherein:
the lower electrode is formed of a platinum thin film.
4. The piezoelectric thin film device according to claim 1 , wherein:
between the lower electrode and the piezoelectric thin film is interposed a thin film of a material selected from a group consisting of LaNiO 3 , NaNbO 3 and (K 1-x Na x )NbO 3 (0<x<1) having a composition ratio x greater than that of the piezoelectric thin film.