IP Library Granted Patent US 8,250,506
Granted Patent B2
US 8,250,506 · App. 12/359,131 · Granted Aug 21, 2012

Bondwire design

Assignee: Helic S.A.
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Quick Facts
Patent No.
US 8,250,506
App. No.
12/359,131
Granted
Aug 21, 2012
Kind
B2
Abstract

A system and method of designing the physical shape of and determining the electromagnetic characteristics of a bondwire in an electrical circuit, comprising the steps of enabling a user to define the position of the bondwire in the electrical circuit layout, defining the position and loop shape of the bondwire in a 3D representation of the electrical circuit, segmenting the bondwire into discrete segments, determining the electromagnetic characteristics of each of the bondwire segments thereby to determine the overall electromagnetic characteristics of the bondwire.

Claims (114)

1. A method of determining the electromagnetic characteristics of bondwires in an electrical circuit, comprising the steps of:

defining, using a computer including a non-transitory computer readable medium and processor, a position of a bondwire in an electrical circuit layout;

defining a 3D position of the bondwire in the electrical circuit layout;

representing the bondwire by one or more discrete segments;

determining electromagnetic characteristics including inductance, resistance and capacitive coupling, of each of the segments, as a single workflow process thereby to determine overall electromagnetic characteristics of the bondwire, using a procedure comprising the steps of

calculating the resistance, self inductance and self capacitance for each segment using closed-form equations

selecting a pair of segments

projecting the segments using vector analysis onto a common plane; and

calculating using closed form equations at least one of

the mutual inductance between the segments using their projections onto the common plane, and

the coupling capacitance between the segments using their projections onto the common plane; and

repeating the above steps for all pairs of segments.

2. The method of claim 1 further comprising:

enabling a user to determine a loop shape of the bondwire, wherein the loop shape is selected by the user from a predetermined range of loop shapes, using a graphical user interface.

3. The method of claim 1 further comprising:

enabling a user to determine a loop shape of the bondwire, wherein the loop shape is selected automatically based on properties of the electrical circuit such as selected interconnecting nodes of the bondwire within the electrical circuit.

4. The method of claim 1 wherein the bondwire is further defined by one or more of:

diameter of the bondwire;

bondwire metal resistivity;

injection mould dielectric constant;

presence of a ground plane or other electromagnetic shield; and

substrate dielectric constant.

5. The method of claim 1 further comprising the step of:

determining the electromagnetic coupling between a bondwire segment and at least one proximal element in the electrical circuit wherein the relative positions of the bondwire segment and the proximal element are analyzed using vector analysis; and

determining the electromagnetic coupling of two or more proximal elements, wherein each proximal element is at least one of a second bondwire segment forming part of the bondwire, a segment of a proximal bondwire, and a proximal component.

6. The method of claim 5 wherein determining the electromagnetic coupling includes determining mutual inductance between the elements.

7. The method of claim 5 wherein determining the electromagnetic coupling includes determining coupling capacitance between the elements and wherein the coupling capacitance is determined by

dividing each bondwire segment and each proximal element into a plurality of infinitesimal sections,

calculating the coupling capacitance between the plurality of infinitesimal sections, and

integrating across each bondwire segment to calculate the coupling capacitance of each bondwire segment.

8. The method of claim 1 further comprising the use of a graphical user interface to enable a user to select the position of a bondwire in the electrical circuit, wherein the graphical user interface enables the user to define the position in a 2D representation of the electrical circuit and in a 3D representation of the electrical circuit.

9. The method of claim 1 further comprising the step of characterizing one or more bondwires in an electrical circuit and generating an output of the characteristics of all or part of the bondwires as a netlist.

10. The method of claim 9 wherein the overall electromagnetic characteristics include resistance, inductance, capacitance, and mutual inductance (RLCK) of the bondwire.

11. The method of claim 1 further comprising:

modeling of the self-inductance and resistance of the individual bondwire segments; and

wherein results of the modeling are stored in a format suitable for integration with known integrated circuit modeling and or manufacturing packages as a netlist.

12. A non-transitory computer readable medium, including instructions stored thereon, which when read and executed by a computer cause the computer to perform the steps of:

defining, using a computer including a non-transitory computer readable medium and processor, a position of a bondwire in an electrical circuit layout;

defining a 3D position of the bondwire in the electrical circuit layout;

representing the bondwire by one or more discrete segments;

determining electromagnetic characteristics including inductance, resistance and capacitive coupling, of the or each of the segments, as a single workflow process thereby to determine overall electromagnetic characteristics of the bondwire, using a procedure comprising the steps of

calculating the resistance, self inductance and self capacitance for each segment using closed-form equations

selecting a pair of segments

projecting the segments using vector analysis onto a common plane; and

calculating using closed form equations at least one of

the mutual inductance between the segments using their projections onto the common plane, and

the coupling capacitance between the segments using their projections onto the common plane; and

repeating the above steps for all pairs of segments.

13. The non-transitory computer readable medium of claim 12 further comprising the steps of:

determining the electromagnetic coupling between a bondwire segment and at least one proximal element in the electrical circuit wherein the relative positions of the bondwire segment and the proximal element are analyzed using vector analysis; and

determining the electromagnetic coupling of two or more proximal elements, wherein each proximal element is at least one of a second bondwire segment forming part of the bondwire, a segment of a proximal bondwire, and a proximal component.

14. The non-transitory computer readable medium of claim 13 wherein determining the electromagnetic coupling includes determining mutual inductance between the elements.

15. The non-transitory computer readable medium of claim 14 wherein determining the electromagnetic coupling further includes determining coupling capacitance between the elements and wherein the coupling capacitance is determined by

dividing each bondwire segment and each proximal element into a plurality of infinitesimal sections,

calculating the coupling capacitance between the plurality of infinitesimal sections, and

integrating across each bondwire segment to calculate the coupling capacitance of each bondwire segment.

16. The non-transitory computer readable medium of claim 15 further comprising the step of characterizing one or more bondwires in an electrical circuit and generating an output of the characteristics of all or part of the bondwires as a netlist.

17. The non-transitory computer readable medium of claim 16 wherein the overall electromagnetic characteristics include resistance, inductance, capacitance, and mutual inductance (RLCK) of the bondwire.

18. A system for determining the electromagnetic characteristics of a bondwire in an electrical circuit, comprising:

a computer including a non-transitory computer readable medium and a processor;

a user interface to enable a user to define the position of the bondwire in the electrical circuit;

an input device suitable for defining one or more bondwire interconnects;

a logic adapted to determine the position of the bondwire in a 3D representation of the electrical circuit and to segment the bondwire into discrete segments;

a modeler to model the electromagnetic behavior including inductance, resistance and capacitive coupling, of each segment, as a single workflow process thereby to model each segment as a netlist, using a procedure comprising the steps of:

calculating the resistance, self inductance and self capacitance for each segment using closed-form equations,

selecting a pair of segments,

projecting the segments using vector analysis onto a common plane,

calculating using closed form equations at least one of:

the mutual inductance between the segments using their projections onto the common plane, and

the coupling capacitance between the segments using their projections onto the common plane, and

repeating the above steps for all pairs of segments; and

a writeable memory for storing the netlist.

19. A method of manufacturing an electrical circuit comprising the steps of:

using at least one of a model, characterization, and definition of an electrical circuit according to the method of

defining, using a computer including a non-transitory computer readable medium and processor, a position of a bondwire in an electrical circuit layout,

defining a 3D position of the bondwire in the electrical circuit layout,

representing the bondwire by one or more discrete segments,

determining electromagnetic characteristics including inductance, resistance and capacitive coupling, of each of the segments, as a single workflow process thereby to determine overall electromagnetic characteristics of the bondwire, using a procedure comprising the steps of

calculating the resistance, self inductance and self capacitance for each segment using closed-form equations

selecting a pair of segments

projecting the segments using vector analysis onto a common plane; and

calculating using closed form equations at least one of

the mutual inductance between the segments using their projections onto the common plane, and

the coupling capacitance between the segments using their projections onto the common plane; and

repeating the above steps for all pairs of segments; and

assembling components of the electrical circuit having bondwires according to the model, characterization, and definition.

20. The method of manufacturing an electrical circuit of claim 19 wherein the step of using at least one of a model, characterization, and definition of an electrical circuit includes creating the at least one of a model, characterization, and definition of an electrical circuit.

21. A method of manufacturing an electrical circuit comprising the steps of:

using at least one of a model, characterization, and definition of an electrical circuit according to the method of

dividing bondwires in segments, using a computer including a non-transitory computer readable medium and processor,

determining electromagnetic characteristics including inductance, resistance and capacitive coupling, of each of the segments, as a single workflow process thereby to determine overall electromagnetic characteristics of the bondwire, using a procedure comprising the steps of:

calculating the resistance, self inductance and self capacitance for each segment using closed-form equations,

selecting a pair of segments,

projecting the segments using vector analysis onto a common plane, and

calculating using closed form equations at least one of:

the mutual inductance between the segments using their projections onto the common plane, and

the coupling capacitance between the segments using their projections onto the common plane, and

repeating the above steps for all pairs of segments; and

assembling components of the electrical circuit having bondwires according to the model, characterization, and definition.

22. The method of manufacturing an electrical circuit of claim 21 wherein the step of using at least one of a model, characterization, and definition of an electrical circuit includes creating the at least one of a model, characterization, and definition of an electrical circuit.

23. A method of manufacturing an electrical circuit comprising the steps of:

accepting at least one of a model, characterization, and definition of an electrical circuit according to the method of

defining, using a computer including a non-transitory computer readable medium and processor, a position of a bondwire in an electrical circuit layout,

defining a 3D position of the bondwire in the electrical circuit layout,

representing the bondwire by one or more discrete segments,

determining electromagnetic characteristics including inductance, resistance and capacitive coupling, of each of the segments, as a single workflow process thereby to determine overall electromagnetic characteristics of the bondwire, using a procedure comprising the steps of

calculating the resistance, self inductance and self capacitance for each segment using closed-form equations

selecting a pair of segments

projecting the segments using vector analysis onto a common plane; and

calculating using closed form equations at least one of

the mutual inductance between the segments using their projections onto the common plane, and

the coupling capacitance between the segments using their projections onto the common plane; and

repeating the above steps for all pairs of segments; and

assembling components of the electrical circuit having bondwires according to the model, characterization, and definition.

Assignments (2)
MERGER Recorded Jan 7, 2021
From: HELIC, INC.
To: ANSYS, INC.
Reel/Frame 054850/0070 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 6, 2009
From: BANTAS, SOTIRIOS; NIKELLIS, KONSTANTINOS
To: HELIC S.A.
Reel/Frame 022220/0889 →
Priority Claims (2)
GB 0801411.0 · Jan 25, 2008 · national
GB 0815745.5 · Aug 29, 2008 · national
Continuity (1)
Related Publication 20090193370A1 · Jul 30, 2009