Chemical mechanical polishing pad

1. A chemical mechanical polishing pad comprising:

a polishing surface;

a non-polishing surface that is provided opposite to the polishing surface;

a side surface that connects an outer edge of the polishing surface and an outer edge of the non-polishing surface; and

a plurality of grooves formed in the polishing surface,

wherein the side surface comprises a slope surface that is connected to the polishing surface,

wherein a depth of the grooves is equal to or smaller than a height of the slope surface,

wherein the polishing surface is circular,

wherein the pad further comprises a plurality of circular grooves formed in the polishing surface,

wherein the polishing surface is concentric with the plurality of circular grooves, and

wherein a ratio, e/d, of a distance, e, between the outer edge of the polishing surface and the groove closest to the outer edge of the polishing surface to a distance, d, between adjacent grooves among the plurality of grooves is 0.3 to 2.

2. The pad of claim 1 , wherein an angle theta formed by the polishing surface and the slope surface inside the pad is larger than 90° and smaller than 180°, and

wherein the angle theta faces the non-polishing surface.

3. The pad of claim 1 , wherein the slope surface comprises (i) a first slope surface and (ii) a second slope surface, an angle formed by the first slope surface (i) and the polishing surface differing from an angle formed by the second slope surface (ii) and the polishing surface;

wherein the first slope surface (i) is connected to the polishing surface and the second slope surface (ii) so that an angle theta 1 formed by the first slope surface (i) and the polishing surface inside the pad is larger than 90° and smaller than 180°, the angle theta 1 facing the non-polishing surface; and

wherein the second slope surface (ii) is connected to the first slope surface (i) so that an angle theta 2 formed by the second slope surface (ii) and the first slope surface inside the pad is larger than 90° and smaller than 180°, the angle theta 2 facing the non-polishing surface.

4. The pad of claim 1 , wherein the side surface comprises (i) a first surface, (ii) a second surface, (iii) a third surface, and (iv) a fourth surface, in this order from the outer edge of the polishing surface;

wherein the first surface (i) is connected to the polishing surface and the second surface (ii) so that an angle theta 3 formed by the first surface (i) and the polishing surface inside the pad is larger than 90° and smaller than 180°, the angle theta 3 facing the non-polishing surface;

wherein the second surface (ii) is connected to the first surface (i) and the third surface (iii) so that an angle theta 4 formed by the second surface (ii) and the polishing surface inside the pad is smaller than the angle theta 3 formed by the first surface (i) and the polishing surface, the angle theta 4 facing the non-polishing surface;

wherein the third surface (iii) is parallel to the polishing surface and is connected to the second surface (ii) and the fourth surface (iv); and

wherein the fourth surface (iv) is connected to the third surface (iii) and the non-polishing surface so that an angle theta 5 formed by the fourth surface (iv) and the polishing surface or the third surface (iii) inside the pad is smaller than the angle formed by the first surface (i) and the polishing surface, the angle theta 5 facing the non-polishing surface.

5. The pad of claim 1 , wherein the slope surface surrounds all of the entire outer edge of the polishing surface.

6. The pad of claim 1 , having a pitch of 0.15 to 105 mm.

7. The pad of claim 6 , wherein the pitch is 0.5 to 13 mm.

8. The pad of claim 6 , wherein the pitch is 0.5 to 5.0 mm.

9. The pad of claim 6 , wherein the pitch is 1.0 to 2.2 mm.

10. The pad of claim 2 , wherein the angle theta is 100° to 170°.

11. The pad of claim 2 , wherein the angle theta is 110° to 150°.

12. The pad of claim 1 , wherein a height of the slope surface is 0.1 to 2.5 mm.

13. The pad of claim 1 , wherein a height of the slope surface is 0.2 to 2.0 mm.

14. The pad of claim 1 , wherein the ratio, e/d, is 0.35 to 1.9.

15. The pad of claim 1 , wherein the ratio, e/d, is 0.35 to 1.87.

16. The pad of claim 1 , wherein the ratio, e/d, is 0.35 to 1.67.

17. The pad of claim 1 , wherein the ratio, e/d, is 0.35 to 1.6.

18. The pad of claim 1 , wherein the polishing surface is crosslinked.

19. The pad of claim 1 , wherein the polishing surface comprises 1,2-polybutadiene.