Exposure mask and pattern forming method therefor
View Patent ↗An exposure mask is constituted of hole-patterns whose scales are higher than the limit resolution of exposure light and which are repetitively aligned in X-Y directions with the prescribed pitch (ranging from 140 nm to 180 nm) therebetween, halftone phase shift regions whose transmission factors range from 2% to 20% and each of which is aligned between two hole-patterns adjacently lying in the X-direction or the Y-direction so as to apply an inverse phase to incidence light, and light preventive regions each of which is aligned between two hole-patterns adjacently lying in an oblique direction inclined to the X-direction or Y-direction by 45°. The exposure mask is illuminated with azimuthal polarization light which is produced by a secondary light source of a zonal illumination and whose polarization direction is perpendicular to the radial direction of the secondary light source.
1. An exposure mask comprising:
a plurality of rectangular patterns whose scales are higher than a limit resolution of exposure light and which are repetitively aligned in a first direction and a second direction, which are perpendicular to each other;
a plurality of semitransparent regions, each of which is aligned between two rectangular patterns adjacently lying in either the first direction or the second direction so as to apply an inverse phase to incident light; and
a plurality of light preventive regions, each of which is aligned between two rectangular patterns adjacently lying in a third direction which differs from the first direction and the second direction,
wherein a pitch between adjacent ones of said plurality of rectangular patterns in the first direction is equal to a sum of widths, in the first direction, of respective adjacent ones of said plurality of rectangular patterns and said plurality of light preventive regions.
2. The exposure mask according to claim 1 , wherein the plurality of semitransparent regions each has a transmission factor ranging from 2% to 20%.
3. An exposure mask comprising:
a plurality of rectangular patterns whose scales are higher than a limit resolution of exposure light and which are repetitively aligned in a first direction and a second direction, which are perpendicular to each other, wherein the rectangular patterns are composed of semitransparent regions for applying an inverse phase to incidence light;
a plurality of light preventive regions, each of which is aligned between two rectangular patterns adjacently lying in either the first direction or the second direction; and
a plurality of transparent regions, each of which is aligned between two rectangular patterns adjacently lying in a third direction which differs from the first direction and the second direction,
wherein a pitch between adjacent ones of said plurality of rectangular patterns in the first direction is equal to a sum of widths, in the first direction, of respective adjacent ones of said plurality of rectangular patterns and said plurality of transparent regions.
4. The exposure mask according to claim 3 , wherein the scale of each of the semitransparent regions is smaller than the scale of a pattern actually formed on a wafer in correspondence with the semitransparent regions, and wherein each of the plurality of transparent regions aligned between the two rectangular patterns adjacently lying in the third direction has a transmission factor of 30% or more when the transmission factor of the semitransparent regions ranges from 2% to 20%.
5. The exposure mask according to claim 1 , wherein the third direction is inclined to the first direction and the second direction by 45°.
6. The exposure mask according to claim 3 , wherein the third direction is inclined to the first direction and the second direction by 45°.
7. The exposure mask according to claim 1 , wherein the pitch is less than a wavelength of the exposure light.
8. The exposure mask according to claim 3 , wherein the pitch is less than a wavelength of the exposure light.
9. A pattern forming method for forming a pattern on a wafer by use of an exposure mask comprising:
a plurality of rectangular patterns whose scales are higher than a limit resolution of exposure light and which are repetitively aligned in a first direction and a second direction, which are perpendicular to each other;
a plurality of semitransparent regions, each of which is aligned between two rectangular patterns adjacently lying in either the first direction or the second direction so as to apply an inverse phase to incident light; and
a plurality of light preventive regions, each of which is aligned between two rectangular patterns adjacently lying in a third direction which differs from the first direction and the second direction,
wherein a pitch between adjacent ones of said plurality of rectangular patterns in the first direction is equal to a sum of widths, in the first direction, of respective adjacent ones of said plurality of rectangular patterns and said plurality of light preventive regions, and
wherein the exposure mask is illuminated with linear polarization light by an oblique incident illumination.
10. A pattern forming method for forming a pattern on a wafer by use of an exposure mask comprising:
a plurality of rectangular patterns whose scales are higher than a limit resolution of exposure light and which are repetitively aligned in a first direction and a second direction, which are perpendicular to each other, wherein the rectangular patterns are composed of semitransparent regions for applying an inverse phase to incidence light;
a plurality of light preventive regions, each of which is aligned between two rectangular patterns adjacently lying in either the first direction or the second direction; and
a plurality of transparent regions, each of which is aligned between two rectangular patterns adjacently lying in a third direction which differs from the first direction and the second direction,
wherein a pitch between adjacent ones of said plurality of rectangular patterns in the first direction is equal to a sum of widths, in the first direction, of respective adjacent ones of said plurality of rectangular patterns and said plurality of transparent regions, and
wherein the exposure mask is illuminated with linear polarization light by an oblique incident illumination.
11. The pattern forming method according to claim 9 , wherein the linear polarization light is produced by a secondary light source forming a zonal illumination so that a polarization direction thereof is perpendicular to a radial direction of the secondary light source.
12. The pattern forming method according to claim 10 , wherein the linear polarization light is produced by a secondary light source forming a zonal illumination so that a polarization direction thereof is perpendicular to a radial direction of the secondary light source.
13. The pattern forming method according to claim 9 , wherein the linear polarization light is produced by a cross-pole illumination constituted of two pairs of two secondary light sources positioned opposite to each other so that a polarization direction thereof is perpendicular to a direction for oppositely aligning the two secondary light sources.
14. The pattern forming method according to claim 10 , wherein the linear polarization light is produced by a cross-pole illumination constituted of two pairs of two secondary light sources positioned opposite to each other so that a polarization direction thereof is perpendicular to a direction for oppositely aligning the two secondary light sources.