IP Library Granted Patent US 7,859,011
Granted Patent B2
US 7,859,011 · App. 12/368,171 · Granted Dec 28, 2010

High ion/Ioff SOI MOSFET using body voltage control

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Quick Facts
Patent No.
US 7,859,011
App. No.
12/368,171
Granted
Dec 28, 2010
Kind
B2
Abstract

A semiconductor device may comprise a partially-depleted SOI MOSFET having a floating body region disposed between a source and drain. The floating body region may be driven to receive injected carriers for adjusting its potential during operation of the MOSFET. In a particular case, the MOSFET may comprise another region of semiconductor material in contiguous relationship with a drain/source region of the MOSFET and on a side thereof opposite to the body region. This additional region may be formed with a conductivity of type opposite the drain/source, and may establish an effective bipolar device per the body, the drain/source and the additional region. The geometries and doping thereof may be designed to establish a transport gain of magnitude sufficient to assist the injection of carriers into the floating body region, yet small enough to guard against inter-latching with the MOSFET.

Claims (11)

1. A semiconductor device comprising:

a partially-depleted MOSFET formed above a buried dielectric layer;

a bias circuit coupled to bias a floating body of the partially-depleted MOSFET; and

a thyristor coupled to the partially-depleted MOSFET for selectable access of the thyristor via a channel in the floating body of the partially-depleted MOSFET.

2. The semiconductor device of claim 1 , in which the bias circuit comprises a voltage source and means for coupling the voltage source to the floating body.

3. The semiconductor device of claim 2 , in which the bias circuit further comprises a controller to control a voltage level of the voltage source.

4. The semiconductor device of claim 3 , in which the controller is configured to apply one of at least two different voltage levels to the floating body region dependent on operable selection from a group consisting of a first selection for a high off state isolation for the partially-depleted MOSFET and a second selection for a high drive current operability for the partially-depleted MOSFET.

5. The semiconductor device of claim 1 , wherein a gate electrode of the thyristor is for capacitively coupling to a base region of the thyristor.

6. The semiconductor device of claim 1 , wherein:

the buried dielectric layer is of a semiconductor-on-insulator substrate structure; and

the bias provided from the bias circuit is selectable to reduce both subthreshold voltage swing and change in gate-to-source voltage for operation of the partially-depleted MOSFET.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 21, 2013
From: T-RAM SEMICONDUCTOR, INC.
To: T-RAM (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 031694/0018 →
PURCHASE OPTION AGREEMENT Recorded Jun 3, 2010
From: T-RAM SEMICONDUCTOR, INC.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 024474/0979 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 10, 2009
From: LEE, ZACHARY K.; NEMATI, FARID; ROBINS, SCOTT
To: T-RAM, INC.
Reel/Frame 022237/0782 →
CHANGE OF NAME Recorded Feb 10, 2009
From: T-RAM, INC.
To: T-RAM SEMICONDUCTOR, INC.
Reel/Frame 022237/0939 →