Substrate processing apparatus
View Patent ↗A substrate processing apparatus includes a processing chamber, a substrate holding part that holds substrates of required numbers in the processing chamber, a gas supply/exhaust part that supplies or exhausts required gas into the processing chamber, a rotation part that rotates the substrate holding part, a first heating part provided in the substrate holding part so as to face at least an upper surface of each substrate held by the substrate holding part, and a power supply part that supplies power to the first heating part in a non-contact state by electromagnetic coupling.
1. A substrate processing apparatus comprising:
a processing chamber;
a substrate holding part that holds substrates of required numbers in the processing chamber;
a gas supply/exhaust part that supplies or exhausts required gas into said processing chamber;
a rotation shaft having a hollow cylindrical shape, with a thick part thereof further hollowed, that rotates said substrate holding part;
a first heating part provided in said substrate holding part so as to face at least an upper surface of each substrate held by the substrate holding part;
a power supply part that supplies power to the first heating part in a non-contact state by electromagnetic coupling,
wherein said power supply part includes at least two cylindrical shaped power supply plates electrically connected to a high frequency power source and at least two cylindrical shaped electrostatic coupling plates electrically connected to said first heating part, and said power supply plates and said electrostatic coupling plates are provided concentrically with a rotation shaft of said substrate holding part.
2. The substrate processing apparatus according to claim 1 , wherein said substrate holding part includes a plurality of supports with an internal hollow structure, and a plurality of heating plates with the internal hollow structure supported by said supports, said each heating part is provided in the inside of said heating plate, and power from said power supply part is supplied to said each heating plate by a lead line arranged to pass through an interior of said hollow structure.
3. The substrate processing apparatus according to claim 2 , wherein inactive gas is enclosed in the interior of said hollow structure, so that its internal pressure is set at 100 Torr or more.
4. The substrate processing apparatus according to claim 1 , wherein a cylindrical shaped second heating part is further provided at the outside of said reaction chamber.
5. The substrate processing apparatus according to claim 4 , further comprising a controller, wherein said controller controls said first heating part so that heat generation quantity to a center of each facing substrate can be larger than the heat generation quantity to a peripheral part of a substrate.
6. The substrate processing apparatus according to claim 1 , wherein a cylindrical shaped second heating part is further provided at the outside of said reaction chamber.
7. The substrate processing apparatus according to claim 6 further comprising a controller, wherein said controller controls said first heating part so that heat generation quantity to a center of each facing substrate can be larger than the heat generation quantity to a peripheral part of a substrate.