IP Library Granted Patent US 7,906,947
Granted Patent B2
US 7,906,947 · App. 12/384,829 · Granted Mar 15, 2011

Microprocessor die with integrated voltage regulation control circuit

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Quick Facts
Patent No.
US 7,906,947
App. No.
12/384,829
Granted
Mar 15, 2011
Kind
B2
Abstract

An integrated circuit die includes a microprocessor and a control circuit to control elements of a voltage regulator to supply power to the microprocessor.

Claims (22)

1. An integrated circuit (IC) die, comprising:

a processor; and

a control circuit to control elements of a voltage regulator to supply power to the processor, wherein

the processor includes at least one monitoring point on the IC die,

the control circuit includes a respective sensor at one or more of the at least one monitoring points,

the respective sensors are configured to monitor circuit activity at the respective monitoring points,

and wherein the control circuit is configured to control the elements of the voltage regulator at least in part based on information from the sensors.

2. The integrated circuit die of claim 1 , wherein at least one of the respective sensors is configured to monitor a frequency of a signal at the respective monitoring point.

3. The integrated circuit die of claim 1 , wherein at least one of the respective sensors is configured to monitor instruction activity at the respective monitoring point.

4. The integrated circuit die of claim 1 , wherein at least one of the respective sensors is configured to monitor dispatch rates at the respective monitoring point.

5. The integrated circuit die of claim 1 , wherein at least one of the respective sensors is configured to monitor pipeline activity at the respective monitoring point.

6. The integrated circuit die of claim 1 , wherein at least one of the respective sensors is configured to read a register of the processor on the IC die.

7. The integrated circuit die of claim 6 , wherein the sensor configured to read a register of the processor on the IC die comprises a digital comparator.

8. The integrated circuit die of claim 1 , wherein said at least one monitoring point is at a pipeline, cache and/or input/output component of the processor.

9. The integrated circuit die of claim 1 , wherein said at least one monitoring point is at a buffer and/or register of the processor.

10. An apparatus, comprising:

a processor formed on an integrated circuit (IC) die;

a control circuit to control elements of a voltage regulator to supply power to the processor, said control circuit formed on said IC die; and

a voltage converter to supply power to the control circuit, the voltage converter separate from said voltage regulator, said voltage converter located off-die.

11. The apparatus of claim 10 , wherein

the processor includes at least one monitoring point on the IC die, and

the control circuit includes a respective sensor at one or more of the at least one monitoring points.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 15, 2022
From: INTEL CORPORATION
To: TAHOE RESEARCH, LTD.
Reel/Frame 061175/0176 →