Resin compositions, films using the same and process for producing the films
View Patent ↗The present invention provides a resin composition containing a reactive monomer and/or oligomer having allyl ester groups, a film of the resin composition which is excellent in transparency and heat resistance and has a high thickness precision, and a process for producing such a film. The resin composition includes (A) a reactive oligomer having allyl ester groups and represented by the general formula (1): wherein R 1 represents an alkanediyl or alkenediyl group having 1 to 4 carbon atoms with the proviso that a plurality of R 1 groups may be the same or different, R 2 represents a cycloalkanediyl, cycloalkenediyl or arenediyl group with the proviso that a plurality of R 2 groups may be the same or different, and n represents an average degree of polymerization and is a number of 1 to 30; (B) a polyfunctional (meth)acrylic monomer and/or oligomer; and (C) a thermal polymerization initiator.
1. A resin composition comprising the following components (A) to (C):
(A) a reactive oligomer having allyl ester groups and represented by the following general formula (1):
wherein R 1 represents an alkanediyl or alkenediyl group having 1 to 4 carbon atoms with the proviso that a plurality of R 1 groups may be the same or different, R 2 represents a cycloalkanediyl, cycloalkenediyl or arenediyl group with the proviso that a plurality of R 2 groups may be the same or different, and n represents an average degree of polymerization and is a number of 1 to 30;
(B) a polyfunctional (meth)acrylic monomer and/or oligomer; and
(C) a thermal polymerization initiator.
2. The resin composition according to claim 1 , further comprising (D) a photopolymerization initiator.
3. The resin composition according to claim 1 , further comprising (E) an allyl ester monomer represented by the following general formula (2):
wherein R 3 represents an alkanediyl group, an alkenediyl group, a cycloalkanediyl group, a cycloalkenediyl group or an arenediyl group.
4. The resin composition according to claim 1 , wherein contents of the components (A) to (C) in the resin composition are (A)30 to 98.7% by mass, (B)1 to 30% by mass and (C)0.1 to 10% by mass, respectively.
5. The resin composition according to claim 2 , wherein contents of the components (A) to (D) in the resin composition are (A)30 to 98.7% by mass, (B)1 to 30% by mass, (C)0.1 to 10% by mass and (D)0.1 to 10% by mass, respectively.
6. The resin composition according to claim 3 , wherein contents of the components (A) to (E) in the resin composition are (A)30 to 98.7% by mass, (B)1 to 30% by mass, (C)0.1 to 10% by mass, (D)0.1 to 10% by mass and (E)0.1 to 60% by mass, respectively.
7. The resin composition according to claim 1 , wherein the resin composition is used to form a film.
8. A semi-cured film obtained by spreading the resin composition as defined in claim 1 on a substrate, and then gelating the spread resin composition by energy ray irradiation.
9. A cured film obtained by thermally treating the semi-cured film as defined in claim 8 .
10. A process for producing a semi-cured film, comprising the steps of spreading the resin composition as defined in claim 1 on a substrate, and irradiating the spread resin composition with an energy ray.
11. A process for producing a cured film, comprising the steps of spreading the resin composition as defined in claim 1 on a substrate, irradiating the spread resin composition with an energy ray, and thermally treating the spread resin composition.