Manufacture of high strength, high density carrier plate
View Patent ↗A carrier plate for supporting electronic components during processing includes hexagonally-arranged holes for supporting the components. Walls of the holes comprise a gripping resilient material. The hexagonal arrangement provides a strong carrier that improves production yield through an increase in per batch processing and improved locational accuracy over conventional carriers.
1. A method of manufacturing a carrier plate for supporting a plurality of electronic components, comprising:
placing a carrier core between a first mold part and a second mold part, wherein the first mold part includes a facing surface facing the carrier core and a first plurality of pins extending therefrom and the second mold part includes a facing surface facing the carrier core and a second plurality of pins extending therefrom and the carrier core includes:
a frame portion forming an outer peripheral edge of the carrier core;
a web portion surrounded by core frame portion and recessed from opposing surfaces of the frame portion facing the facing surfaces of the first mold part and the second mold part; and
a plurality of hexagonally-arranged bores extending through the web portion and perpendicular to the facing surfaces of the first mold part and the second mold part, and each of the plurality of first and second pins extending through a respective one of the plurality of hexagonally-arranged bores;
injecting a resilient material through a respective gate in each of the first mold part and the second mold part to form a molded part, wherein the carrier core is placed between the first mold part and the second mold part such that a distance between each upstream one of the plurality of hexagonally-arranged bores and its adjacent downstream one of the plurality of hexagonally-arranged bores is greater than a distance between each bore of the plurality of hexagonally-arranged bores and its nearest adjacent bore; and
finishing opposing surfaces of the molded part to a desired thickness.
2. The method according to claim 1 wherein injecting the resilient material further comprises:
injecting a resilient material until gaps between the web portion and the facing surfaces of the first mold part and the second mold part are filled with the resilient material.
3. The method according to claim 1 , further comprising:
heating the first mold part and the second mold part before injecting the resilient material; and wherein a same material forms the carrier core, the first mold part and the second mold part.
4. The method according to claim 1 wherein each of the plurality of first and second pins has a smaller diameter than each of the plurality of hexagonally-arranged bores; and wherein injecting the resilient material further comprises:
injecting the resilient material into gaps formed when each of the plurality of first and second pins extends through a respective one of the plurality of hexagonally-arranged bores.
5. A method of manufacturing a carrier plate for supporting a plurality of electronic components, comprising:
placing a carrier core between a first mold part and a second mold part, wherein the first mold part includes a facing surface facing the carrier core and a first plurality of pins extending therefrom and the second mold part includes a facing surface facing the carrier core and a second plurality of pins extending therefrom and the carrier core includes:
a frame portion forming an outer peripheral edge of the carrier core;
a web portion surrounded by core frame portion and recessed from opposing surfaces of the frame portion facing the facing surfaces of the first mold part and the second mold part; and
a plurality of hexagonally-arranged bores extending through the web portion and perpendicular to the facing surfaces of the first mold part and the second mold part, and each of the plurality of first and second pins extending through a respective one of the plurality of hexagonally-arranged bores;
injecting a resilient material through a respective gate in each of the first mold part and the second mold part to form a molded part, wherein the carrier core is placed between the first mold part and the second mold part such that a distance between each upstream one of the plurality of hexagonally-arranged bores and its adjacent downstream one of the plurality of hexagonally-arranged bores is greater than a distance between each bore of the plurality of hexagonally-arranged bores and its nearest adjacent bore; and
finishing opposing surfaces of the molded part to a desired thickness; and
wherein the carrier core is rectangular in shape and the gates in each of the first mold part and the second mold part extend along one edge of the carrier core where the frame portion and the web portion are joined and extend for at least a length of the web portion along the one edge of the carrier core.
6. A method of manufacturing a carrier plate for supporting a plurality of electronic components, comprising:
placing a carrier core between a first mold part and a second mold part, wherein the first mold part includes a facing surface facing the carrier core and a first plurality of pins extending therefrom and the second mold part includes a facing surface facing the carrier core and a second plurality of pins extending therefrom and the carrier core includes:
a frame portion forming an outer peripheral edge of the carrier core;
a web portion surrounded by core frame portion and recessed from opposing surfaces of the frame portion facing the facing surfaces of the first mold part and the second mold part; and
a plurality of hexagonally-arranged bores extending through the web portion and perpendicular to the facing surfaces of the first mold part and the second mold part, and each of the plurality of first and second pins extending through a respective one of the plurality of hexagonally-arranged bores;
injecting a resilient material through a respective gate in each of the first mold part and the second mold part to form a molded part, wherein the carrier core is placed between the first mold part and the second mold part such that a distance between each upstream one of the plurality of hexagonally-arranged bores and its adjacent downstream one of the plurality of hexagonally-arranged bores is greater than a distance between each bore of the plurality of hexagonally-arranged bores and its nearest adjacent bore; and
finishing opposing surfaces of the molded part to a desired thickness; and
wherein each of the facing surfaces of the first mold part and the second mold part comprises:
a first surface portion in fitting engagement with at least a portion of the frame portion; and
a second surface portion recessed from the first surface portion and facing the web portion.
7. The method according to claim 6 wherein each of the gates comprises a recessed portion between at least part of the first surface portion and the second surface portion.
8. The method according to claim 1 wherein the plurality of first pins and the plurality of second pins are no more than 20% different in total number.
9. The method according to claim 1 wherein the plurality of first pins and the plurality of second pins alternate in groups across a surface of the web portion.
10. The method according to claim 1 wherein the plurality of hexagonally-arranged bores is arranged such that a distance between a downstream bore and another bore immediately upstream of the downstream bore in a flow direction of the resilient material is larger than a spacing between adjacent bores forming a hexagonal shape.
11. The method according to claim 1 wherein the first plurality of pins are fixedly engaged with the first mold part and the second plurality of pins are fixedly engaged with the second mold part.
12. The method according to claim 1 wherein outer tips of the first plurality of pins opposite from the facing surface of the first mold part fit into a respective blind hole in the facing surface of the second mold part, and outer tips of the second plurality of pins opposite from the facing surface of the second mold part fit into a respective blind hole in the facing surface of the first mold part.
13. The method according to claim 1 wherein outer tips of the first plurality of pins opposite from the facing surface of the first mold part fit into a respective blind hole in the facing surface of the second mold part, and outer tips of the second plurality of pins opposite from the facing surface of the second mold part fit into a respective blind hole in the facing surface of the first mold part.
14. The method according to claim 1 , further comprising:
forming the carrier plate of a sheet of material having a first surface and an opposed second surface by drilling the plurality of hexagonally-arranged bores through the sheet of material in equidistantly-spaced rows and columns, wherein bores in every other row align to form a respective column such that bores of the hexagonally-arranged bores for a plurality of regular hexagons surrounding a respective central bore.
15. The method according to claim 5 , further comprising:
forming the carrier plate of a sheet of material having a first surface and an opposed second surface by drilling the plurality of hexagonally-arranged bores through the sheet of material in equidistantly-spaced rows and columns, wherein bores in every other row align to form a respective column such that bores of the hexagonally-arranged bores for a plurality of regular hexagons surrounding a respective central bore.
16. The method according to claim 6 , further comprising:
forming the carrier plate of a sheet of material having a first surface and an opposed second surface by drilling the plurality of hexagonally-arranged bores through the sheet of material in equidistantly-spaced rows and columns, wherein bores in every other row align to form a respective column such that bores of the hexagonally-arranged bores for a plurality of regular hexagons surrounding a respective central bore.