Electronic device including an inductor
View Patent ↗An electronic device can include an inductor overlying a shock-absorbing layer. In one aspect, the electronic device can include a substrate, an interconnect level overlying the substrate, and the shock-absorbing layer overlying the interconnect level. The inductor can include conductive traces and looped wires. The conductive traces can be attached to the conductive traces over the shock-absorbing layer. In another aspect, a process can be used to form the electronic device including the inductor. In still another aspect, an electronic device can a toroidal-shaped inductor that includes linear inductor segments that are connected in series.
1. An electronic device comprising:
a substrate;
an interconnect level overlying the substrate, wherein the interconnect level comprises a first interconnect and a second interconnect;
a shock-absorbing layer overlying the interconnect level, wherein the shock-absorbing layer includes a first opening over the first interconnect and a second opening over the second interconnect; and
a first inductor including conductive traces and at least one looped wire, wherein:
the conductive traces include a first conductive trace and a second conductive trace;
a first via pad portion of the first conductive trace extends to the first opening of the shock-absorbing layer and is electrically connected to the first interconnect, and a primary pad portion of the first conductive trace overlies the shock-absorbing layer;
a secondary pad portion of the second conductive trace overlies the shock-absorbing layer, and a via portion of the second conductive trace extends to the second opening of the shock-absorbing layer and is electrically connected to the second interconnect;
a first looped wire of the at least one wire is wire bonded to the primary pad portion of the first conductive trace; and
the first looped wire or a second looped wire of the at least one wire is wire bonded to the secondary pad portion of the second conductive trace.
2. The electronic device of claim 1 , wherein the shock absorbing layer comprises an organic polymer.
3. The electronic device of claim 1 , wherein:
the conductive traces include third conductive traces overlying the shock-absorbing layer;
each of the third conductive traces includes a primary pad portion and a secondary pad portion; and
the at least one looped wire include third looped wires bonded between the primary pad portions and the secondary pad portions of adjacent third conductive traces, wherein the third looped wires are bonded at areas overlying the shock-absorbing layer.
4. The electronic device of claim 3 , wherein for each of the third conductive traces, the primary pad portion is smaller than the secondary pad portion.
5. The electronic device of claim 4 , wherein from a top view:
the primary pad portions of the third conductive traces are oriented along a substantially straight line; and
the secondary pad portions of the third conductive traces are oriented in a staggered formation.
6. The electronic device of claim 1 , further comprising an insulating layer overlying the interconnect level and underlying the shock-absorbing layer, wherein:
the insulating layer includes an inorganic material; and
the insulating layer includes a third opening overlying the first interconnect and a fourth opening overlying the second interconnect.
7. The electronic device of claim 6 , wherein:
the interconnect level further comprises bonding pads;
the insulating layer includes fifth openings overlying the bonding pads; and
the shock-absorbing layer includes sixth openings overlying the bonding pads.
8. The electronic device of claim 7 , wherein:
the insulating layer abuts the first interconnect, the second interconnect, and the shock-absorbing layer;
the shock-absorbing layer includes polyimide and abuts the conductive traces; and
the conductive traces include an adhesion/barrier layer and a conductive layer.
9. The electronic device of claim 7 , wherein the bonding pads and the conductive traces comprise gold.
10. The electronic device of claim 1 , further comprising a radio-frequency shielding element adjacent to the first inductor, wherein the radio-frequency shielding element is in a form of a grid.
11. The electronic device of claim 1 , further comprising an electronic component lying at least partly within the substrate.
12. The electronic device of claim 1 , further comprising a first transistor lying below the first looped wire.
13. The electronic device of claim 12 , wherein the first transistor is at least partly disposed within a well region.
14. The electronic device of claim 12 , further comprising a second transistor that does not lie below the first looped wire.
15. The electronic device of claim 1 , wherein the first inductor is part of a toroidal-shape inductor.
16. An electronic device comprising:
a workpiece; and
a toroidal-shaped inductor overlying the workpiece, wherein:
the toroidal-shaped inductor includes linear inductor segments that are connected in series; and
the linear inductor segments include a first linear inductor segment that includes the first inductor of claim 1 .
17. The electronic device of claim 16 , wherein the conductive traces abut the shock-absorbing layer.
18. The electronic device of claim 17 , wherein:
the shock-absorbing layer includes polyimide; and
the conductive traces include an adhesion/barrier layer and a conductive layer.
19. The electronic device of claim 16 , further comprising a radio-frequency shielding element in a form of a grid.
20. The electronic device of claim 16 , wherein the conductive traces comprise gold.