Recording head for heat assisted magnetic recording

1. An apparatus comprising:

first and second poles magnetically coupled to each other and positioned on opposite sides of a waveguide; and

a near-field transducer (NFT) adjacent to the waveguide and a heat sink positioned adjacent the NFT and capable of cooling the NFT.

2. The apparatus of claim 1 , wherein the near-field transducer comprises a disk and a peg positioned between the disk and an air bearing surface, and the heat sink makes contact with the disk.

3. The apparatus of claim 2 , wherein a region of contact between the heat sink and the disk is spaced from an edge of the disk.

4. The apparatus of claim 1 , wherein the first pole includes a first portion spaced from the waveguide and a second portion extending from the first portion toward the air bearing surface, with the second portion being structured such that an end of the second portion is closer to the core layer of the waveguide than the first portion.

5. The apparatus of claim 1 , wherein the heat sink comprises a thermally conductive dielectric material.

6. An apparatus comprising:

first and second poles magnetically coupled to each other and positioned on opposite sides of a waveguide;

a near-field transducer positioned adjacent to the waveguide; and

a heat sink positioned adjacent the near-field transducer and capable of cooling the near-field transducer.

7. The Apparatus of claim 6 , wherein the first pole includes a first portion spaced from the waveguide and a second portion extending from the first portion toward the air bearing surface, with the second portion being structured such that an end of the second portion is closer to the core layer of the waveguide than the first portion and wherein the heat sink is positioned between the near-field transducer and the second portion of the first pole.

8. The apparatus of claim 6 , wherein the near-field transducer comprises a disk and a peg positioned between the disk and an air bearing surface.

9. The apparatus of claim 8 , wherein the heat sink makes contact with the disk.

10. The apparatus of claim 6 , wherein the heat sink is thermally connected with the first pole.

11. The apparatus of claim 6 wherein the heat sink comprises diamond like carbon (DLC material).

12. The apparatus of claim 6 , wherein the heat sink comprises a thermally conductive dielectric material.

13. An apparatus comprising:

a waveguide having a core layer and an end adjacent to an air bearing surface;

a near-field transducer positioned adjacent to a focal point of the waveguide;

a heat sink positioned adjacent the near-field transducer, wherein the heat sink is capable of cooling the near-field transducer; and

first and second poles magnetically coupled to each other and positioned on opposite sides of the waveguide.

14. The apparatus of claim 13 , wherein the first pole includes a first portion spaced from the waveguide and a second portion extending from the first portion toward the air bearing surface.

15. The apparatus of claim 14 , wherein the second portion being structured such that an end of the second portion is closer to the core layer of the waveguide than the first portion.

16. The apparatus of claim 14 , wherein the heat sink is positioned between the near-field transducer and the second portion of the first pole.

17. The apparatus of claim 13 , wherein the heat sink is made of at least one of Au, Cu, Al, and Ag.

18. The apparatus of claim 13 , wherein the wherein the near-field transducer comprises a disk and a peg positioned between the disk and the air bearing surface.

19. The apparatus of claim 18 , wherein the heat sink is parallel to the air bearing surface.

20. The apparatus of claim 13 , wherein the heat sink comprises a thermally conductive dielectric material.