ELECTRONIC DEVICE
An electronic device includes an insulative substrate, a spiral inductor formed by an interconnection layer provided on a first surface of the insulative layer, a first chip that is mounted on a second surface of the insulative layer opposite to the first surface and is electrically connected to a passive circuit including the spiral inductor, the first chip having an electrically conductive substrate, and a first protrusion that is provided on one of the first and second surface of the insulative substrate and protrudes therefrom, the first protrusion being electrically connected to one of the passive circuit and the first chip to an external circuit.
1 . An electronic device comprising:
an insulative substrate;
a spiral inductor formed by an interconnection layer provided on a first surface of the insulative layer;
a first chip that is mounted on a second surface of the insulative layer opposite to the first surface and is electrically connected to a passive circuit including the spiral inductor, the first chip having an electrically conductive substrate; and
a first protrusion that is provided on one of the first and second surface of the insulative substrate and protrudes therefrom, the first protrusion being electrically connected to one of the passive circuit and the first chip to an external circuit.
2 . The electronic device as claimed in claim 1 , further comprising a second chip provided on the first surface of the insulative substrate.
3 . The electronic device as claimed in claim 2 , wherein the second chip has a substrate having a conductivity lower than that of the electrically conductive substrate of the first chip.
4 . The electronic device as claimed in claim 2 , wherein the second chip is provided above the spiral inductor.
5 . The electronic device as claimed in claim 1 , wherein the spiral inductor includes a first coil of a spiral shape provided on the insulative substrate, and a second coil of a spiral shape spaced apart from and located above the first coil.
6 . The electronic device as claimed in claim 1 , wherein the first protrusion includes an insulative member and first electrodes that are provided on an end of the insulative member and is electrically connected to the one of the passive circuit and the first chip.
7 . The electronic device as claimed in claim 6 , wherein the insulative member is integrally formed with the insulative substrate.
8 . The electronic device as claimed in claim 6 , wherein the first protrusion is spaced apart from the insulative substrate and is connected thereto by connecting portions.
9 . The electronic device as claimed in claim 1 , wherein the first protrusion includes a first lid that hermetically covers the first chip and/or the spiral inductor.
10 . The electronic device as claimed in claim 9 , wherein the first protrusion includes first electrodes that are provided on an outer surface of the first lid and electrically connect the one of the passive circuit and the first chip to the external circuit.
11 . The electronic device as claimed in claim 9 , wherein the first lid includes a shield electrode.
12 . The electronic device as claimed in claim 2 , further comprising a second lid that is provided on the first surface of the insulative substrate and mounts the second chip above the spiral inductor.
13 . The electronic device as claimed in claim 12 , wherein the second protrusion and the second chip hermetically cover the spiral inductor.
14 . The electronic device as claimed in claim 13 , wherein a SAW device, an FBAR device or a MEMS device is formed on a surface of the second chip that faces the upper surface of the insulative substrate.
15 . The electronic device as claimed in claim 1 , further comprising a second protrusion that is provided on the other one of the first and second surface of the insulative substrate and hermetically covers the first chip and/or the spiral inductor.
16 . The electronic device as claimed in claim 15 , further comprising a third chip mounted on an outer surface of the second lid.
17 . The electronic device as claimed in claim 15 , wherein the second protrusion is provided on the first surface of the insulative substrate, and the second lid hermetically covers the spiral inductor and the second chip provided above the spiral inductor.
18 . The electronic device as claimed in claim 17 , wherein the second chip includes a SAW device, an FBAR device or a MEMS device, and the spiral inductor includes a first coil of a spiral shape provided on the insulative substrate, and a second coil of a spiral shape spaced apart from and located above the first coil.
19 . The electronic device as claimed in claim 1 , wherein the insulative substrate is a ceramic substrate.