Multi-die wafer level packaging
View Patent ↗A semiconductor die package is provided. The semiconductor die package includes a plurality of dies arranged in a stacked configuration. Through-silicon vias are formed in the lower or intermediate dies to allow electrical connections to dies stacked above. The lower die is positioned face up and has redistribution lines electrically coupling underlying semiconductor components to the through-silicon vias. The dies stacked above the lower die may be oriented face up such that the contact pads are facing away from the lower die or flipped such that the contact pads are facing the lower die. The stacked dies may be electrically coupled to the redistribution lines via wire bonding or solder balls. Additionally, the lower die may have another set of redistribution lines on an opposing side from the stacked dies to reroute the vias to a different pin-out configuration.
1. A method of packaging semiconductor dies, the method comprising:
providing a wafer having a first die, the first die having a protective layer formed thereon, the first die having semiconductor structures on a first side and the protective layer formed on a second side, the first side being an opposing side of the second side, the first die having vias formed through the first die and the protective layer, the first die further having first redistribution lines electrically coupling the semiconductor structures to the vias; and
attaching a second die to the first die, the second die facing the first side of the first die, contact pads of the second die being electrically coupled to respective ones of the first redistribution lines.
2. The method of claim 1 , further comprising forming second redistribution lines on the second side of the first die, each of the second redistribution lines being electrically coupled to respective ones of the vias.
3. The method of claim 1 , wherein the attaching is performed by orienting the second die such that the contact pads face the first die and electrically coupling the contact pads to the respective ones of the first redistribution lines with solder balls.
4. The method of claim 1 , wherein the attaching is performed by orienting the second die such that the contact pads face away from the first die and electrically coupling the contact pads to the respective ones of the first redistribution lines with wire bonds.
5. The method of claim 1 , wherein the providing the first die includes:
attaching a carrier wafer to the first die;
removing at least a portion of the second side of the first die, thereby causing the vias to protrude from the second side of the first die;
forming the protective layer over the second side of the first die, the vias being at least partially exposed; and
removing the carrier wafer.
6. The method of claim 5 , further comprising forming second redistribution lines over the protective layer prior to the removing the carrier wafer, the second redistribution lines being electrically coupled to respective ones of the vias.
7. The method of claim 1 , further comprising after the attaching dicing the wafer to singulate the first die.
8. A method of packaging semiconductor dies, the method comprising:
providing a first wafer having a first die thereon, the first die having a first substrate, the first substrate having semiconductor structures formed on a first surface, the first substrate having one or more dielectric layers and metal layers formed on the first surface, the first die further having deep conductive vias formed partially through the first substrate and first redistribution lines electrically coupling the semiconductor structures to respective ones of the deep conductive vias;
attaching a carrier wafer to the first wafer on a first side facing the first redistribution lines;
exposing at least a portion of the deep conductive vias on a second side of the first die such that the deep conductive vias protrude from the second side of the first die, the second side being an opposing side of the first side;
forming a protective layer over the first substrate between the deep conductive vias such that the deep conductive vias are exposed;
removing the carrier wafer; and
attaching a second die to the first die, the second die facing the first redistribution lines, contact pads of the second die being electrically coupled to respective ones of the first redistribution lines.
9. The method of claim 8 , wherein the exposing is performed at least in part by grinding.
10. The method of claim 8 , wherein the exposing is performed at least in part by etching.
11. The method of claim 8 , wherein the attaching the second die is performed such that the contact pads of the second die face away from the first die and are electrically coupled to respective ones of the first redistribution lines via wire bonding.
12. The method of claim 8 , wherein the attaching the second die is performed such that the contact pads of the second die face the first die and are electrically coupled to respective ones of the first redistribution lines via solder balls.
13. The method of claim 8 , further comprising after the attaching the second die dicing the first wafer to singulate the first die.
14. A method of packaging semiconductor dies, the method comprising:
providing a first wafer having a first side and an opposing second side, the first wafer having a first plurality of dies;
attaching a carrier wafer to the first side of the first wafer;
removing at least a portion of the second side of the first wafer to cause through-silicon vias to protrude from a surface of the second side;
forming a protective layer over the second side of the first wafer between the protruding through-silicon vias, the through-silicon vias being at least partially exposed;
removing the carrier wafer; and
attaching a second plurality of dies to respective ones of the first plurality of dies, contact pads on each of the second plurality of dies being electrically coupled to respective ones of first redistribution lines on the first wafer, the first redistribution lines being electrically coupled to respective ones of the through-silicon vias.
15. The method of claim 14 , wherein the attaching the second plurality of dies includes:
orienting each of the second plurality of dies over respective dies of the first wafer such that the contact pads of the second plurality of dies faces the first wafer; and
electrically coupling with solder balls the contact pads of the second plurality of dies to respective ones of first redistribution lines on the first wafer.
16. The method of claim 14 , wherein the attaching the second plurality of dies includes:
orienting each of the second plurality of dies over respective dies of the first wafer such that the contact pads of the second plurality of dies faces away from the first wafer; and
electrically coupling with wire bonds the contact pads of the second plurality of dies to respective ones of first redistribution lines on the first wafer.
17. The method of claim 14 , further comprising dicing the first wafer into singulated dies.
18. The method of claim 14 , further comprising forming second redistribution lines over the protective layer.
19. The method of claim 18 , further comprising forming solder balls on the second redistribution lines.
20. The method of claim 14 , further comprising forming solder balls directly on exposed portions of the through-silicon vias.