IP Library Granted Patent US 8,197,704
Granted Patent B2
US 8,197,704 · App. 12/397,447 · Granted Jun 12, 2012

Plasma processing apparatus and method for operating the same

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Quick Facts
Patent No.
US 8,197,704
App. No.
12/397,447
Granted
Jun 12, 2012
Kind
B2
Abstract

The invention provides a plasma processing apparatus and a method for purging the apparatus, capable of preventing damage of components caused by pressure difference during purging operation of a vacuum reactor, and capable of preventing residual processing gas from remaining in the vacuum reactor. Inert gas is introduced through an inert gas feed port 233 on a side wall of a depressurized processing chamber (V 1 ) 226 of a plasma processing apparatus, and the interior of the processing chamber (V 1 ) 226 is brought to predetermined pressure by the inert gas, and thereafter, the inert gas is supplied to processing gas supply paths 213 and 216 (V 2 ) communicated to a plurality of through holes 224 for introducing processing gas, so as to introduce the inert gas through the plurality of through holes 224 into the processing chamber (V 1 ) 226.

Claims (7)

1. A method for operating a plasma processing apparatus configured to process a sample placed on an upper surface of a sample stage disposed in an interior of a processing chamber arranged in a vacuum reactor using plasma generated within the processing chamber, the plasma processing apparatus including a plate member arranged on an upper surface of the processing chamber above the sample stage having a plurality of through holes through which processing gas is introduced, an evacuation port arranged below the sample stage in the processing chamber for evacuating gas from the processing chamber, a pump arranged below the evacuation port in communication therewith for evacuating the interior of the processing chamber, an inert gas feed port arranged on a side wall of the processing chamber for supplying inert gas into the processing chamber having been depressurized, and a supply path communicated with the through holes through which the processing gas is supplied, the method comprising the following steps before a step of maintenance or cleaning of an inner surface of the processing chamber:

a step of supplying the inert gas through an inert gas feed port arranged on a side wall of the processing chamber into the processing chamber having been depressurized, so as to bring the processing chamber to a first pressure which is lower than a pressure of the atmosphere outside the vacuum reactor; and thereafter,

a step of supplying the inert gas, while stopping the supply of the inert gas from the inert gas feed port, so as to introduce the inert gas through the through holes into the processing chamber.

2. The method for operating a plasma processing apparatus according to claim 1 , further comprising:

a step of opening the interior of the processing chamber, after the step of introducing the inert gas through the through holes, and after the pressure within the processing chamber has reached a pressure equivalent to or higher than the pressure of the atmosphere outside the vacuum reactor.

3. The method for operating a plasma processing apparatus according to claim 1 , further comprising:

a step of repeatedly performing, after processing the sample, an operation to evacuate the interior of the processing chamber through the evacuation port using the pump, and an operation to close the evacuation port to introduce inert gas through the inert gas feed port, and thereafter, introducing the inert gas through the through holes into the processing chamber.

Assignments (1)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →