Microcavity enhanced surface acoustic wave devices
Shear-horizontal surface acoustic wave sensors with micro-cavities in the delay paths were studied using finite element methods. The microcavity devices are SAW delay path devices that have the delay path etched with square patterns at various wavelength dimensions and varying depths to increase the dispersion and bulk to surface wave conversion. Additionally the microcavities are filed with polystyrene to act as an inhomogeneous waveguide for further entrapment of wave energy near the device surface. The effects of micro-cavities and grooves on SAW propagation show significantly greater energy transmission than the other structures presented traditional sensors.
1. A surface acoustic device, comprising
a piezoelectric substrate further comprising a first face and a second face;
a plurality of inter-digitated transducers disposed on the first face of the substrate;
an array comprising a plurality of micro-cavities disposed on the first face of the substrate;
wherein the micro-cavities are circular, triangular, pentagonal, or square when viewed from the first face of the substrate; and
wherein the micro-cavities are filled with a waveguide material, where the waveguide material has a lower density and lower acoustic velocity than the substrate.
2. The surface acoustic device of claim 1 , wherein the micro-cavities have x-y dimensions selected from the group consisting of λ/2×λ/2, λ/4×λ/4, and λ/8×λ/8, wherein λ is the wavelength of a wave propagated through the piezoelectric substrate.
3. The surface acoustic device of claim 2 , wherein the micro-cavities have a z-dimension selected from the group consisting of λ/2, λ/4, and λ/8.
4. The surface acoustic device of claim 2 , wherein the micro-cavities are λ/2×λ/2×λ/8 and filled with polystyrene.
5. The surface acoustic device of claim 1 , wherein the substrate has the dimensions 40λ long, 5λ wide and 5λ deep, wherein λ is the wavelength of a wave propagated through the piezoelectric substrate.
6. The surface acoustic device of claim 1 , wherein the substrate is selected from the group consisting of quartz, R-plane sapphire, lithium niobate, lithium tantalate, gallium arsenide (GaAs), silicon carbide (SiC), langasite (LGS), zinc oxide (ZnO), aluminum nitride (AlN), lead zirconium titanate (PZT), polyvinylidene fluoride (PVdF), and 36° YX LiTaO 3 .
7. The surface acoustic device of claim 1 , wherein the inter-digitated transducers are 2λ long and λ/4 wide, wherein λ is the wavelength of a wave propagated through the piezoelectric substrate.
8. The surface acoustic device of claim 7 , wherein the inter-digitated transducers have a periodicity of 40 μm.
9. The surface acoustic device of claim 1 , wherein the waveguide material filling the micro-cavities is polystyrene.
10. The surface acoustic device of claim 1 , wherein twenty micro-cavities are disposed on the face of the substrate.
11. The surface acoustic device of claim 1 , wherein the micro-cavities are disposed in an array of 4 rows of 5 micro-cavities.
12. The surface acoustic device of claim 1 , wherein the device is adapted for use in a device selected from the group consisting of a sensor, a RF filter, a bandpass filter, an intermediate frequency filter, a voltage-controlled oscillator, an equalizer delay line, a multiple access delay line, a pressure transducer, and a convolver.
13. A method for increasing surface acoustic wave (SAW) device sensitivity comprising the steps of:
providing a piezoelectric substrate with first face and a second face;
etching an array comprising a plurality of micro-cavities on the first face of the substrate, wherein the micro-cavities are circular, triangular, pentagonal, or square when viewed from the first face of the substrate;
wherein the micro-cavities are filled with a waveguide material, where the waveguide material has a lower density and lower acoustic velocity than the substrate; and
adding a plurality of inter-digitated transducers disposed on the first face of the substrate.
14. The method of claim 13 , wherein the micro-cavities have x-y dimensions selected from the group consisting of λ/2×λ/2, λ/4×λ/4, and λ/8×λ/8, wherein λ is the wavelength of a wave propagated through the piezoelectric substrate.
15. The method of claim 13 , wherein the micro-cavities have a z-dimension selected from the group consisting of λ/2, λ/4, and λ/8, wherein λ is the wavelength of a wave propagated through the piezoelectric substrate.
16. The method of claim 13 , wherein the waveguide material is polystyrene.
17. A method for decreasing surface acoustic wave (SAW) device power requirements comprising the steps of:
providing a piezoelectric substrate with first face and a second face;
etching an array comprising a plurality of micro-cavities on the first face of the substrate, wherein the micro-cavities are circular, triangular, pentagonal, or square when viewed from the first face of the substrate;
wherein the micro-cavities are filled with a waveguide material, where the waveguide material has a lower density and lower acoustic velocity than the substrate; and
adding a plurality of inter-digitated transducers disposed on the first face of the substrate.
18. The method of claim 17 , wherein the micro-cavities have x-y dimensions selected from the group consisting of λ/2×λ/2, λ/4×λ/4, and λ/8×λ/8, wherein λ is the wavelength of a wave propagated through the piezoelectric substrate.
19. The method of claim 17 , wherein the micro-cavities have a z-dimension selected from the group consisting of λ/2, λ/4, and λ/8, wherein λ is the wavelength of a wave propagated through the piezoelectric substrate.
20. The method of claim 17 , wherein the waveguide material is polystyrene.