Joining jig and method for manufacturing a bonded body of different members by using the jig
A joining jig 5 is constituted of a pair of flat-plate sandwiching portions 17, 18 including sandwiching faces 15 which sandwich therebetween a plate member laminate 4 prepared by laminating two plate members 2, 3 with providing a solder on a joined face between the plate members. The joining jig has a plurality of vapor inflow ports provided in the sandwiching face 15 so that surplus solder vapor on the joined face flows into the vapor inflow ports in a case where the plate member laminate 4 is heated while sandwiching the plate member laminate between the pair; vapor flow paths provided so that the vapor flow paths communicate with the vapor inflow ports; and vapor discharge ports 42 provided in the side surface of the joining jig so that the vapor discharge ports communicate with the vapor flow paths to discharge the vapor of the solder to the outside.
1. A joining jig comprising:
a pair of flat-plate sandwiching portions including sandwiching faces which sandwich a plate member laminate body which is joined;
a plurality of vapor inflow ports provided on a sandwiching face of a first flat-plate sandwiching portion so that the plurality of vapor inflow ports receive a surplus vapor of solder generated by heating the plate member laminate body;
a plurality of vapor flow paths provided inside the first flat-plate sandwiching portion and on an upper face of the first flat-plate sandwiching portion that is opposite the sandwiching face so that the vapor flow paths communicate with the vapor inflow ports to constitute flow paths of the surplus vapor of the solder; and
a plurality of vapor discharge ports provided on a side surface of the first flat-plate sandwiching portion so that the vapor discharge ports communicate with the vapor flow paths to discharge the surplus vapor of the solder to the outside, wherein
the plurality of vapor flow paths provided on the upper face form channels in the upper face that terminate at the vapor discharge ports, and
the vapor discharge ports are adjacent to the upper face and do not extend to the sandwiching face.
2. The joining jig according to claim 1 , wherein the vapor flow paths are provided so as to connect the adjacent vapor inflow ports to each other.
3. The joining jig according to claim 1 , wherein the plurality of vapor discharge ports are provided at intervals over a partial periphery of the side surface.
4. The joining jig according to claim 1 , wherein at least a part of the vapor flow paths are provided in a lattice-like shape in parallel with the sandwiching face.
5. The joining jig according to claim 1 , wherein the vapor flow paths have widths of 0.05 to 50 mm and depths of 0.05 to 50 mm.
6. The joining jig according to claim 1 , wherein when the plate member laminate is sandwiched between the pair of sandwiching portions, one of the plate members has a plurality of back holes connecting a joined face of the one plate member to the plurality of vapor inflow ports, and
in a case where the plate member laminate is heated while the plate member laminate is sandwiched between the pair of sandwiching portions, the surplus solder vapor on the joined face is allowed to flow into the vapor inflow ports from the plurality of back holes, and is discharged from the plurality of vapor discharge ports through the vapor flow paths to obtain a bonded body of different plate members in which the plate members are joined to each other.
7. The joining jig according to claim 6 , wherein the pair of sandwiching portions are made of a material having a thermal conductivity (W/m 2 ·K) 1.5 times or more as large as that of the one plate member.
8. A manufacturing method of a bonded body of different plate members, comprising the steps of:
sandwiching the plate member laminate between the sandwiching faces of the joining jig according to claim 6 so that the plurality of back holes communicate with at least a part of the plurality of vapor inflow ports;
heating the plate member laminate to a temperature at which the solder melts or a higher temperature;
decreasing the pressure of a heating atmosphere to a pressure lower than the vapor pressure of the solder to allow the surplus solder vapor on the joined face to flow into the vapor inflow ports from the back holes; and
discharging the vapor from the vapor discharge ports through the vapor flow paths to obtain the bonded body of different plate members in which the plate members are joined to each other.
9. A manufacturing method of a bonded body of different plate members, comprising the steps of:
sandwiching the plate member laminate between the sandwiching faces of the joining jig according to claim 7 so that the plurality of back holes communicate with at least a part of the plurality of vapor inflow ports;
heating the plate member laminate to a temperature at which the solder melts or a higher temperature;
decreasing the pressure of a heating atmosphere to a pressure lower than the vapor pressure of the solder to allow the surplus solder vapor on the joined face to flow into the vapor inflow ports from the back holes; and
discharging the vapor from the vapor discharge ports through the vapor flow paths to obtain the bonded body of different plate members in which the plate members are joined to each other.
10. The manufacturing method of the bonded body of different plate members according to claim 8 , wherein the one plate member constituting the bonded body of different members has groove portions communicating with the back holes as introduction holes of a kneaded forming clay and provided along the joined face in a lattice-like shape,
another plate member constituting the bonded body of different plate members is provided with slits to form a forming material into a lattice-like shape, the slits being formed into a lattice-like shape so as to communicate with the groove portions, and
the bonded body of different plate members in which the plate members are joined to each other is manufactured as a die to form a honeycomb structure.