IP Library › Granted Patent US 7,791,363
Granted Patent B2
US 7,791,363 · App. 12/401,842 · Granted Sep 7, 2010

Low temperature probing apparatus

Assignee: Star Technologies Inc.
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Quick Facts
Patent No.
US 7,791,363
App. No.
12/401,842
Granted
Sep 7, 2010
Kind
B2
Abstract

A low temperature probing apparatus comprises a housing, a device holder positioned in the housing and configured to receive at least one semiconductor device under test, a platen positioned on the housing, at least one hydraulic stage positioned on the platen and configured to retain at least one probe, a cover positioned on the platen and configured to form an isolation chamber with the hydraulic stage and the device holder positioned therein, and a hydraulic controller configured to control the movement of the hydraulic stage.

Claims (37)

1. A low temperature probing apparatus, comprising:

a housing;

a device holder positioned in the housing and configured to receive at least one semiconductor device under test;

a platen positioned on the housing;

at least one hydraulic stage positioned on the platen and configured to retain at least one probe;

a cover positioned on the platen and configured to form an isolation chamber with the hydraulic stage and the device holder positioned therein; and

a hydraulic controller outside the housing and configured to control the movement of the hydraulic stage.

2. The low temperature probing apparatus of claim 1 , wherein the cover include a transparent window.

3. The low temperature probing apparatus of claim 2 , further comprising an image-capturing device configured to capture an alignment image of the semiconductor device and the probe through the transparent window.

4. The low temperature probing apparatus of claim 2 , wherein the transparent window includes glass or plastic.

5. The low temperature probing apparatus of claim 1 , wherein the hydraulic stage includes a stationary member positioned on the platen and a movable member configured to retain the probe.

6. The low temperature probing apparatus of claim 5 , wherein the movable member includes a carrier configured to retain the probe.

7. The low temperature probing apparatus of claim 1 , wherein the probe is connected to a tester through an electrical connector positioned on the cover.

8. The low temperature probing apparatus of claim 1 , wherein the probe is connected to a tester through a sleeve positioned on the cover.

9. The low temperature probing apparatus of claim 1 , wherein the hydraulic controller is configured to control the movement of the hydraulic stage by at least one hydraulic tube.

10. The low temperature probing apparatus of claim 9 , wherein the hydraulic tube connects the hydraulic controller to the hydraulic stage through a sleeve positioned on the cover.

11. The low temperature probing apparatus of claim 9 , wherein the hydraulic tube connects the hydraulic controller to the hydraulic stage through a hydraulic connector positioned on the cover.

12. The low temperature probing apparatus of claim 1 , wherein the hydraulic controller is positioned on the cover.

13. A low temperature probing apparatus, comprising:

a housing;

a device holder positioned in the housing and configured to receive at least one semiconductor device under test;

a platen positioned on the housing;

at least one hydraulic stage positioned on the platen and configured to retain a probe card;

a cover positioned on the platen and configured to form an isolation chamber with the hydraulic stage and the device holder positioned therein; and

a hydraulic controller configured to control the movement of the hydraulic stage.

14. The low temperature probing apparatus of claim 13 , wherein the cover include a transparent window.

15. The low temperature probing apparatus of claim 14 , further comprising an image-capturing device configured to capture an alignment image of the semiconductor device and a probe of the probe card through the transparent window.

16. The low temperature probing apparatus of claim 14 , wherein the transparent window includes glass or plastic.

17. The low temperature probing apparatus of claim 13 , wherein the hydraulic stage includes a stationary member positioned on the platen and a movable member configured to retain the probe card.

18. The low temperature probing apparatus of claim 17 , wherein the movable member includes a carrier configured to retain the probe card.

19. The low temperature probing apparatus of claim 13 , wherein the probe card is connected to a tester through an electrical connector positioned on the cover.

20. The low temperature probing apparatus of claim 13 , wherein the probe card is connected to a tester through a sleeve positioned on the cover.

21. The low temperature probing apparatus of claim 13 , wherein the hydraulic controller is configured to control the movement of the hydraulic stage by at least one hydraulic tube.

22. The low temperature probing apparatus of claim 21 , wherein the hydraulic tube connects the hydraulic controller to the hydraulic stage through the sleeve positioned on the cover.

23. The low temperature probing apparatus of claim 21 , wherein the hydraulic tube connects the hydraulic controller to the hydraulic stage through a hydraulic connector positioned on the cover.

24. The low temperature probing apparatus of claim 13 , wherein the hydraulic controller is positioned on the cover.

25. The low temperature probing apparatus of claim 13 , wherein the probe card includes a substrate and at least one probe positioned on the substrate.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2024
From: STAR TECHNOLOGIES, INC.
To: VUETTE PTE. LTD.
Reel/Frame 066561/0434 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 11, 2009
From: LOU, CHOON LEONG
To: STAR TECHNOLOGIES INC.
Reel/Frame 022377/0311 →
Priority Claims (1)
TW 97133853 A · Sep 4, 2008 · national
Continuity (1)
Related Publication 20100052717A1 · Mar 4, 2010