Semiconductor device and method for manufacturing the same
View Patent ↗A semiconductor device has a semiconductor substrate, a semiconductor fin which is formed on the semiconductor substrate, which has a long side direction and a short side direction, and which has a carbon-containing silicon film including an impurity and a silicon film formed on the carbon-containing silicon film, a gate electrode which is formed to face both side surfaces of the semiconductor fin in the short side direction, source and drain regions which are respectively formed in the semiconductor fin located in the direction of both sides in the long side direction of the semiconductor fin so as to sandwich the gate electrode, and an element isolation insulating film which is formed on the side surface of the semiconductor fin and between the gate electrode and the semiconductor substrate.
1. A semiconductor device comprising:
a semiconductor substrate;
a semiconductor fin which is formed on the semiconductor substrate, which has a long side direction and a short side direction, and which has a carbon-containing silicon film including an impurity and a first silicon film stacked on the carbon-containing silicon film;
a gate electrode which is formed to face both side surfaces of the semiconductor fin in the short side direction;
source and drain regions which are respectively formed in the semiconductor fin located in the direction of both sides in the long side direction of the semiconductor fin so as to sandwich the gate electrode; and
an element isolation insulating film which is formed on the side surface of the semiconductor fin and between the gate electrode and the semiconductor substrate,
wherein the first silicon film is not formed on side surfaces of the carbon-containing silicon film.
2. The semiconductor device according to claim 1 , further comprising a second silicon film containing the impurity formed between the carbon-containing silicon film and the semiconductor substrate, and under the carbon-containing silicon film.
3. The semiconductor device according to claim 1 , wherein in the carbon-containing silicon film, the impurity concentration in the boundary surface between the carbon-containing silicon film and the film provided on the carbon-containing silicon film is smaller than the impurity concentration in the boundary surface between the carbon-containing silicon film and the film provided under the carbon-containing silicon film.
4. The semiconductor device according to claim 1 , wherein in the carbon-containing silicon film, the impurity concentration in the boundary surface between the carbon-containing silicon film and the film provided on the carbon-containing silicon film is smaller than the impurity concentration in regions in the carbon-containing silicon film other than the boundary surface.
5. The semiconductor device according to claim 1 , wherein parts of the semiconductor fin corresponding to the source and drain regions are silicon germanium films, and the first silicon film is sandwiched by the silicon germanium films.
6. The semiconductor device according to claim 5 , wherein the lower surface of the first silicon film is located at a position higher than the lower surface of the silicon germanium films.
7. The semiconductor device according to claim 1 , wherein parts of the semiconductor fin corresponding to the source and drain regions are third silicon films, and the short side direction length of the third silicon films is longer than the short side direction length of the first silicon film facing the gate electrode.
8. The semiconductor device according to claim 7 , wherein the upper surface of the third silicon films is located at a position higher than the upper surface of the first silicon film facing the gate electrode.
9. The semiconductor device according to claim 1 , wherein the first silicon film contains germanium.
10. The semiconductor device according to claim 9 , wherein the semiconductor fin further includes a second silicon film containing the impurity under the carbon-containing silicon film.
11. The semiconductor device according to claim 1 , wherein in the carbon-containing silicon film, the impurity concentration in the boundary surface between the carbon-containing silicon film and the film provided on the carbon-containing silicon film is smaller than the impurity concentration in the boundary surface between the carbon-containing silicon film and the film provided under the carbon-containing silicon film.
12. The semiconductor device according to claim 1 , wherein in the carbon-containing silicon film, the impurity concentration in the boundary surface between the carbon-containing silicon film and the film provided on the carbon-containing silicon film is smaller than the impurity concentration in regions in the carbon-containing silicon film other than the boundary surface.
13. A semiconductor device comprising:
a semiconductor substrate;
a semiconductor fin which is formed on the semiconductor substrate, which has a long side direction and a short side direction, and which has a carbon-containing silicon film including an impurity and a silicon film stacked on the carbon-containing silicon film;
a gate electrode which is formed to face both side surfaces of the semiconductor fin in the short side direction;
source and drain regions which are respectively formed in the semiconductor fin located in the direction of both sides in the long side direction of the semiconductor fin so as to sandwich the gate electrode; and
an element isolation insulating film which is formed on the side surface of the semiconductor fin and between the gate electrode and the semiconductor substrate,
wherein in the carbon-containing silicon film, the impurity concentration in the boundary surface between the carbon-containing silicon film and the film provided on the carbon-containing silicon film is smaller than the impurity concentration in the boundary surface between the carbon-containing silicon film and the film provided under the carbon-containing silicon film.
14. A semiconductor device comprising:
a semiconductor substrate;
a semiconductor fin which is formed on the semiconductor substrate, which has a long side direction and a short side direction, and which has a carbon-containing silicon film including an impurity and a silicon film stacked on the carbon-containing silicon film;
a gate electrode which is formed to face both side surfaces of the semiconductor fin in the short side direction;
source and drain regions which are respectively formed in the semiconductor fin located in the direction of both sides in the long side direction of the semiconductor fin so as to sandwich the gate electrode; and
an element isolation insulating film which is formed on the side surface of the semiconductor fin and between the gate electrode and the semiconductor substrate,
wherein in the carbon-containing silicon film, the impurity concentration in the boundary surface between the carbon-containing silicon film and the film provided on the carbon-containing silicon film is smaller than the impurity concentration in regions in the carbon-containing silicon film other than the boundary surface.
15. A semiconductor device comprising:
a semiconductor substrate;
a semiconductor fin which is formed on the semiconductor substrate, which has a long side direction and a short side direction, and which has a carbon-containing silicon film including an impurity and a silicon film stacked on the carbon-containing silicon film;
a gate electrode which is formed to face both side surfaces of the semiconductor fin in the short side direction;
source and drain regions which are respectively formed in the semiconductor fin located in the direction of both sides in the long side direction of the semiconductor fin so as to sandwich the gate electrode; and
an element isolation insulating film which is formed on the side surface of the semiconductor fin and between the gate electrode and the semiconductor substrate,
wherein parts of the semiconductor fin corresponding to the source and drain regions are silicon germanium films, and the first silicon film is sandwiched by the silicon germanium films.
16. The semiconductor device according to claim 15 , wherein the lower surface of the silicon film is located at a position higher than the lower surface of the silicon germanium films.