Method and device for connecting an optical element to a frame
View Patent ↗A method and a device for the material-fit connection of an optical element to a frame are disclosed.
1. A method, comprising:
locally melting and subsequently solidifying a connection medium on at least one connection position between an optical element and a frame so that the optical element is connected to the frame only through the connection medium,
wherein:
the optical element is in the frame;
the optical element and the frame are in mechanical contact with one another via at least three connection positions through non-molten regions of the connection medium during each instant of the local melting and subsequent solidification; and
after solidifying the connection medium, the optical element is not in direct contact with the frame; and
wherein:
the optical element and the frame are connected together on at least four connection positions; and
the method comprises:
providing energy to at least three of the connection positions so that a non-molten region of the connection medium is present while providing the energy; and
subsequently connecting the optical element and the frame by fully melting the connection medium at the connection positions.
2. The method as claimed in claim 1 , wherein the optical element is a circular optical element, on the circumference of which the at least three connection positions are arranged at an angular spacing of about 120°.
3. The method as claimed in one of claim 1 , wherein providing energy comprises irradiating the at least three connection positions with a laser beam.
4. The method as claimed in claim 3 , wherein the laser has a power of about 100 watts for about 50 milliseconds with a laser spot size of about 1 mm 2 .
5. The method as claimed in claim 1 , wherein, prior to being locally melted and subsequently solidified, the connection medium comprises a solder preform with a thickness of about 50 μm to 100 μm and lateral dimensions of about 5×5 mm.
6. The method as claimed in claim 1 , wherein the connection medium is vapor deposited, sputtered or electrolytically applied onto the optical element and/or the frame.
7. The method as claimed in claim 1 , wherein the connection medium comprises a solder comprising tin, lead, bismuth, indium, antimony, gold, silver and/or palladium.
8. The method as claimed in claim 1 , wherein fully melting the connection medium comprises a controlled soldering process while monitoring the temperature of the connection position.
9. The method as claimed in claim 1 , wherein the optical element is a lens or a mirror in a semiconductor lithography projection exposure apparatus.
10. A method, comprising:
using a solder to connect an optical element to a frame on at least one connection point; and
while connecting the optical element to the frame, using a support to mutually position the optical element and the frame to avoid relative movements of the optical element and the frame,
wherein:
the support protrudes from the frame toward the optical element,
the optical element is a component of a semiconductor lithography projection exposure apparatus,
the support is a roof-like support or a point-like support,
the support is releasable from the frame, and
the solder comprises tin, lead, bismuth, indium, antimony, gold, silver and/or palladium.
11. The method as claimed in claim 10 , wherein the optical element rests on the support at at least three points.
12. The method as claimed in claim 10 , wherein the solder is applied as a layer on the frame and/or on the optical element before connecting.
13. The method as claimed in claim 10 , wherein, prior to using the solder to connect the optical element and the frame, the solder is a preform on the frame and/or on the optical element.
14. The method as claimed in claim 13 , wherein the geometrical shape of the preform can be utilized to align the optical element on the frame.
15. The method as claimed in claim 13 , wherein the preform is melted only locally during the soldering process.
16. The method as claimed in claim 10 , wherein the shape of the frame follows the shape of the optical element in the region of the at least one connection position, and the solder has an approximately constant thickness.
17. The method as claimed in claim 10 , wherein a solderable system is applied onto the optical element before connecting the optical element and the frame.
18. The method as claimed in claim 17 , wherein the solderable system comprises openings.
19. The method as claimed in claim 17 , wherein the solderable system is not bounded by sharp edges on the optical element.
20. The method as claimed in claim 10 , wherein the solder is heated by a laser beam.
21. The method as claimed in claim 20 , wherein the laser beam passes through the optical element.
22. The method as claimed in claim 20 , wherein a solderable system is applied onto the optical element before connecting the optical element and the frame, the laser beam is reflected at least partially by the solderable system, and the reflected fraction heats the solder.
23. The method as claimed in claim 20 , wherein the frame is heated by an additional laser beam in the region of the connection position.
24. The method as claimed in claim 23 , wherein the first and additional laser beams are formed from the same laser source.
25. The method as claimed in claim 23 , wherein the additional laser beam is formed from an additional laser source.
26. The method as claimed in claim 10 , wherein the support is in contact with the optical element in the region of an optically active surface of the optical element, and the connection position lies on an optically inactive surface of the optical element.
27. A method, comprising:
using a solder to connect an optical element to a frame on at least one connection point; and
while connecting the optical element to the frame, using a support to mutually position the optical element and the frame to avoid relative movements of the optical element and the frame,
wherein:
the support comprises at least three separate, discrete bearing elements which protrude from the frame toward the optical element,
the optical element rests on the at least three bearing elements,
the optical element is a component of a semiconductor lithography projection exposure apparatus, and
the solder comprises tin, lead, bismuth, indium, antimony, gold, silver and/or palladium.
28. The method of claim 27 , wherein at least one of the at least three separate, discrete bearing elements is a roof-like support.
29. The method of claim 1 , wherein, after solidifying the connection medium, the connection medium contacts only the frame and the optical element.