Digital camera having double housing construction for heat dissipation, high rigidity, and reduced tactile temperature
In order to provide a digital camera which includes a heat dissipating device which can cool sufficiently a solid state image pick-up device and integrated circuits, which has a high rigidity and which affects little the design of the digital camera, there is provided a digital camera comprising a lens unit 15 , a solid state image pick-up device 31 and integrated circuits 41 , wherein a camera housing is made to have a double housing construction by an outer housing 11 which is formed of a member having a low thermal conductivity and an inner housing 61 which is formed of a member having a high rigidity and a high thermal conductivity, wherein a heat dissipating space is defined between the outer housing 11 and the inner housing 61 , the integrated circuits 41 configuring a heat source and the inner housing 61 are connected together by a member having a high thermal conductivity, and wherein the inner housing 61 is made up of a main body side housing which is situated in the vicinity of the solid state image pick-up device 31 and the integrated circuits 41 and a lens side housing 62 which covers a circumferential edge of the lens unit 15 , whereby heat is dissipated from the whole surfaces of the main body side housing and the lens side housing.
1. A digital camera comprising:
a lens unit,
a solid state image pick-up device,
an integrated circuit, and
a camera housing,
wherein the camera housing is made to have a double housing construction by an outer housing which is formed of a member having a low thermal conductivity, and an inner housing which has an opening at a back side end, which is formed of a member having a high rigidity and a high thermal conductivity, and which is made into a heat dissipating device,
wherein a heat dissipating space is defined between the outer housing and the inner housing,
wherein the inner housing has a shape in which at least a part of a component which configures a heat source is accommodated,
wherein a whole of the inner housing is formed by a same material, the inner housing being made up of a main body side housing which is situated in a vicinity of the solid state image pick-up device and the integrated circuit, and a lens side housing which covers a circumferential edge of the lens unit, wherein heat is dissipated from the whole surfaces of the main body side housing and the lens side housing, and
wherein the lens side housing of the inner housing is formed into a cylindrical shape and has openings at a front end side portion and a back end side portion thereof, and the main body side housing of the inner housing is formed into a hollow rectangular parallelepiped shape at the back end side portion of the lens side housing and has the opening at the back side end thereof.
2. The digital camera as set forth in claim 1 , further comprising a member having a high thermal conductivity provided in an interior of the camera housing, wherein the component which configures the heat source and the inner housing are connected together by said member.
3. The digital camera as set forth in claim 2 , wherein said member is connected to the main body side housing of the inner housing at the back side end of the inner housing.
4. The digital camera as set forth in claim 2 , further comprising a plurality of heat conductive sheets which are disposed between the component which configures the heat source and said member, wherein heat generated by the heat source is released to the inner housing via the plurality of heat conductive sheets and said member.