Resistance change memory, and data write and erase methods thereof
View Patent ↗A resistance change memory includes a first interconnection, a second interconnection, a first resistance change element which has a first electrode, a second electrode, and a first tunnel insulating film provided between the first electrode and the second electrode, the first tunnel insulating film including a first trap region formed by introducing defects to trap holes or electrons, and the second electrode being connected to the first interconnection, and a first transistor whose current path has one end connected to the first electrode and the other end connected to the second interconnection.
1. A resistance change memory comprising:
a first line;
a second line substantially parallel to the first line;
a first resistance change element which comprises a first electrode, a second electrode, and a first tunnel insulating film between the first electrode and the second electrode, the first tunnel insulating film comprising a first trap region comprising defects configured to trap either holes or electrons, and the second electrode being connected to the first line; and
a first transistor comprising a current path comprising a first end connected to the first electrode and a second end connected to the second line.
2. The memory of claim 1 , wherein the first trap region is located in at least one of a first interface between the first electrode and the first tunnel insulating film and a second interface between the second electrode and the first tunnel insulating film.
3. The memory of claim 2 , wherein the first trap region is on a film surface of the first tunnel insulating film.
4. The memory of claim 1 , wherein the first tunnel insulating film comprises magnesium oxide, and the first trap region comprises magnesium defects, and
the first trap region is configured to trap the holes in a data write mode.
5. The memory of claim 4 , wherein the first trap region is formed by either oxidizing, ion beam etching, or impurity doping during formation of a magnesium oxide film.
6. The memory of claim 1 , wherein the first tunnel insulating film comprises magnesium oxide, and the first trap region comprises oxygen defects, and
the first trap region is configured to trap the electrons in a data write mode.
7. The memory of claim 6 , wherein the first trap region is formed by introducing either annealing or impurity doping during formation of a magnesium oxide film.
8. The memory of claim 1 , further comprising:
a second resistance change element which comprises a third electrode, a fourth electrode, and a second tunnel insulating film between the third electrode and the fourth electrode, the second tunnel insulating film comprising a second trap region comprising defects configured to trap either holes or electrons, and the fourth electrode being connected to the first line; and
a second transistor comprising a current path comprising a first end connected to the third electrode and a second end connected to the second interconnection.
9. The memory of claim 1 , wherein
the second trap region is in the first tunnel insulating film,
the first trap region comprises defects configured to trap the holes, and
the second trap region comprises defects configured to trap the electrons.
10. A method of writing data in a resistance change memory, the method comprising:
providing the resistance change memory which comprises:
a first line;
a second line substantially parallel to the first line;
a resistance change element which comprises a first electrode, a second electrode, and a tunnel insulating film between the first electrode and the second electrode, the tunnel insulating film comprising a first trap region comprising defects configured to trap either holes or electrons, and the second electrode being connected to the first line; and
a transistor comprising a current path comprising a first end connected to the first electrode and a second end connected to the second line, and
writing data by applying a voltage between the first line and the second line and causing the first trap region to trap the holes or the electrons generated upon impact ionization.
11. The method of claim 10 , wherein the tunnel insulating film comprises a magnesium oxide, and the first trap region comprises magnesium defects, and
the first trap region is configured to trap the holes in order to increase a conductivity of the tunnel insulating film, and to change a resistance value of the resistance change element in a data write mode.
12. The method of claim 11 , wherein the first trap region is formed by either oxidizing, ion beam etching, or impurity doping during formation of a magnesium oxide film.
13. The method of claim 10 , wherein the tunnel insulating film comprises magnesium oxide, and the first trap region comprises oxygen defects, and
the first trap region is configured to trap the electrons in order to decrease a conductivity of the tunnel insulating film, and to change a resistance value of the resistance change element in a data write mode.
14. The method of claim 13 , wherein the first trap region is formed by either annealing or impurity doping during formation of a magnesium oxide film.
15. The method of claim 10 , wherein the first trap region is in at least one of a first interface between the first electrode and the tunnel insulating film and a second interface between the second electrode and the tunnel insulating film.
16. The method of claim 10 , wherein
a second trap region is in the tunnel insulating film, and
the first trap region is configured to trap the holes, and the second trap region is configured to trap the electrons, storing ternary data in the resistance change element in a data write mode.
17. A method of erasing data in a resistance change memory, the method comprising:
providing the resistance change memory which comprises:
a first line;
a second line substantially parallel to the first line;
a resistance change element comprising a first electrode, a second electrode, and a tunnel insulating film between the first electrode and the second electrode, the tunnel insulating film comprising a trap region comprising defects configured to trap either holes or electrons, and the second electrode being connected to the first line; and
a transistor comprising a current path comprising a first end connected to the first electrode and a second end connected to the second line, and
erasing data by applying a voltage between the first line and the second line in order to release either the holes or the electrons trapped by the trap region.
18. The method of claim 17 , wherein the tunnel insulating film comprises magnesium oxide, and the trap region comprises magnesium defects, and the method further comprising:
releasing the holes trapped by the trap region in a data erase mode.
19. The method of claim 17 , wherein the tunnel insulating film comprises magnesium oxide, and the trap region comprises oxygen defects, and the method further comprising:
releasing the electrons trapped by the trap region in a data erase mode.
20. The method of claim 17 , wherein the trap region is in at least one of a first interface between the first electrode and the tunnel insulating film and a second interface between the second electrode and the tunnel insulating film.