Pattern formation method
View Patent ↗After forming a resist film made from a chemically amplified resist material pattern exposure is carried out by selectively irradiating the resist film with exposing light while supplying, onto the resist film, water that includes triphenylsulfonium nonaflate, that is, an acid generator, and is circulated and temporarily stored in a solution storage. After the pattern exposure, the resist film is subjected to post-exposure bake and is then developed with an alkaline developer. Thus, a resist pattern made of an unexposed portion of the resist film can be formed in a good shape.
1. A pattern formation method comprising steps of:
forming a resist film on a substrate;
forming an alkaline-soluble film on said resist film;
performing pattern exposure by selectively irradiating said resist film with exposing light while supplying a liquid between said alkaline-soluble film and a projection lens; and
forming a resist pattern by developing said resist film after the pattern exposure, wherein:
said alkaline-soluble film forms a barrier that diminishes diffusion of acid from said resist film into the liquid, and
in the step of performing pattern exposure, said liquid is being continuously supplied while said resist film is being irradiated.
2. The pattern formation method of claim 1 , wherein the resist film is made of a chemically amplified resist material.
3. The pattern formation method of claim 1 , wherein said alkaline-soluble film is removed by an alkaline-developer.
4. The pattern formation method of claim 3 , wherein said alkaline-soluble film is removed during said step of forming resist pattern.
5. The pattern formation method of claim 1 , wherein, before the step of forming said resist pattern, said alkaline-soluble film is removed by a first liquid which is different from a developer used in the developing of said resist film.
6. The pattern formation method of claim 1 , wherein said alkaline-soluble film comprises polyvinyl alcohol or polyvinyl pyrrolidone.
7. The pattern formation method of claim 1 , wherein, in the step of performing pattern exposure, said liquid is supplied on a localized area of said alkaline-soluble film.
8. The pattern formation method of claim 7 , wherein:
said liquid is supplied by a liquid supplying unit having an inlet for supplying said liquid and an outlet for draining said liquid, and
in the step of performing pattern exposure, said liquid is flowing into said localized area of said alkaline-soluble film from the inlet and is flowing out of said localized area of said alkaline-soluble film from the outlet while said resist film is being irradiated.
9. The pattern formation method of claim 1 , wherein, in the step of forming said resist pattern, said alkaline-soluble film is dissolved by a developer used in the developing of said resist film.
10. The pattern formation method of claim 1 , wherein said liquid is water.
11. The pattern formation method of claim 1 , further comprising a step of baking said alkaline-soluble film and said resist film formed on the substrate before the performing pattern exposure.
12. A semiconductor device fabrication method comprising steps of:
forming a first film on a substrate;
forming a resist film on said first film;
forming an alkaline-soluble film on said resist film;
performing pattern exposure by selectively irradiating said resist film with exposing light while supplying a liquid between said alkaline-soluble film and a projection lens;
forming a resist pattern by developing said resist film after the pattern exposure; and
etching said first film using said resist pattern as an etching mask, wherein:
said alkaline-soluble film forms a barrier that diminishes diffusion of acid from said resist film into the liquid, and
in the step of performing pattern exposure, said liquid is being continuously supplied while said resist film is being irradiated.
13. The semiconductor device fabrication method of claim 12 , wherein the resist film is made of a chemically amplified resist material.
14. The semiconductor device fabrication method of claim 12 ,
wherein said alkaline-soluble film is removed by an alkaline-developer.
15. The semiconductor device fabrication method of claim 12 , wherein, in the step of performing pattern exposure, said liquid is supplied on a localized area of said alkaline-soluble film.
16. The semiconductor device fabrication method of claim 15 , wherein:
said liquid is supplied by a liquid supplying unit having an inlet for supplying said liquid and an outlet for draining said liquid, and
in the step of performing pattern exposure,
said liquid is flowing into said localized area of said alkaline-soluble film from the inlet and is flowing out of said localized area of said alkaline-soluble film from the outlet while said resist film is being irradiated with said exposing light.
17. The semiconductor device fabrication method of claim 12 , wherein, in the step of forming said resist pattern, said alkaline-soluble film is dissolved by a developer used in the developing of said resist film.
18. The semiconductor device fabrication method of claim 12 , wherein said liquid is water.
19. The semiconductor device fabrication method of claim 12 , further comprising a step of baking said alkaline-soluble film and said resist film formed on the substrate before the performing pattern exposure.