Laser micromachining with tailored bursts of short laser pulses
View Patent ↗A series of laser pulse bundles or bursts are used for micromachining target structures. Each burst includes short laser pulses with temporal pulse widths that are less than approximately 1 nanosecond. A laser micromachining method includes generating a burst of laser pulses and adjusting an envelope of the burst of laser pulses for processing target locations. The method includes adjusting the burst envelope by selectively adjusting one or more first laser pulses within the burst to a first amplitude based on processing characteristics of a first feature at a target location, and selectively adjusting one or more second laser pulses within the burst to a second amplitude based on processing characteristics of a second feature at the target location. The method further includes directing the amplitude adjusted burst of laser pulses to the target location.
1. A laser micromachining method comprising:
generating, using an ultrafast laser source, a burst of laser pulses;
adjusting respective amplitudes of individual laser pulses within the burst of laser pulses, using a high-speed optical modulator, to produce a selectively shaped single burst envelope for processing a target location of a workpiece, the target location including a first layer overlying a second layer, wherein the first layer and the second layer comprise different materials with different laser processing characteristics, the adjusting comprising:
selectively adjusting one or more first laser pulses within the single burst envelope to a first amplitude based on processing characteristics of a first layer at a target location; and
selectively adjusting one or more second laser pulses within the single burst envelope to a second amplitude based on processing characteristics of a second layer at the target location; and
directing the amplitude adjusted burst of laser pulses to the target location, the single burst envelope of laser pulses processing both the first layer and the second layer at the same target location.
2. The method of claim 1 , wherein generating the burst of laser pulses comprises:
generating mode-locked laser pulses comprising respective temporal pulse widths that are less than or equal to approximately 1 nanosecond.
3. The method of claim 2 , wherein the respective temporal pulse widths are in a range between approximately 1 nanosecond and approximately 100 femtoseconds.
4. The method of claim 2 , further comprising:
generating the laser pulses at a repetition rate in a range between approximately 100 kHz and approximately 500 MHz.
5. The method of claim 1 , wherein generating the burst of laser pulses comprises:
generating the burst within a temporal width in a range between approximately 1 nanosecond and approximately 1 microsecond.
6. The method of claim 5 , wherein the target location is selected from a group of target types comprising: an electrically conductive link severing target, a material trimming target, a via forming target, a scribing target, and a dicing target.