Method for manufacturing light-emitting device
View Patent ↗The deposition substrate of the present invention includes a light-transmitting substrate having a first region and a second region. In the first region, a first heat-insulating layer transmitting light is provided over the light-transmitting substrate, a light absorption layer is provided over the first heat-insulating layer, and a first organic compound-containing layer is provided over the light absorption layer. In the second region, a reflective layer is provided over the light-transmitting substrate, a second heat-insulating layer is provided over the reflective layer, and a second organic compound-containing layer is provided over the second heat-insulating layer. The edge of the second heat-insulating layer is placed inside the edge of the reflective layer, and there is a space between the first heat-insulating layer and the second heat-insulating layer.
1. A method for manufacturing a light-emitting device, comprising:
disposing a first substrate and a second substrate having a first electrode so that the first substrate faces the first electrode, the first substrate including a first region and a second region and being capable of transmitting light;
the first region including:
a first heat-insulating layer provided over the first substrate, the first heat-insulating layer being capable of transmitting the light;
a light absorption layer provided over the first heat-insulating layer, the light absorption layer being capable of absorbing the light, and
a first organic compound-containing layer provided over the light absorption layer;
the second region including:
a reflective layer provided over the first substrate, the reflective layer being capable of reflecting the light;
a second heat-insulating layer provided over the reflective layer, and
a second organic compound-containing layer provided over the second heat-insulating layer,
wherein an edge of the second heat-insulating layer is placed inside an edge of the reflective layer, and
wherein a space is provided between the first heat-insulating layer and the second heat-insulating layer,
irradiating the light absorption layer with the light through the first substrate and the first heat-insulating layer to evaporate the first organic compound-containing layer, thereby forming a light-emitting layer on the first electrode; and
forming a second electrode layer on the light-emitting layer.
2. The method for manufacturing a light-emitting device according to claim 1 ,
wherein heat is conducted from the light absorption layer to the first organic compound-containing layer.
3. The method for manufacturing a light-emitting device according to claim 1 ,
wherein, after irradiation with the light, the second organic compound-containing layer remains over the second heat-insulating layer.
4. The method for manufacturing a light-emitting device according to claim 1 ,
wherein the first heat-insulating layer prevents heat from being conducted from the light absorption layer to the second region, and
wherein the second heat-insulating layer prevents heat from being conducted from the reflective layer to the second organic compound-containing layer.
5. The method for manufacturing a light-emitting device, according to claim 1 , wherein the light absorption layer is irradiated with the light under reduced pressure.
6. The method for manufacturing a light-emitting device, according to claim 1 , wherein lamp light or laser light is used as the light.