Light-emitting diode and method for fabricating the same
View Patent ↗The invention discloses a method for fabricating a light-emitting diode. In an embodiment of the invention, the method comprises the following steps of (a) preparing a substrate; (b) forming an epitaxial layer on the substrate, wherein the epitaxial layer has an upper surface; (c) forming a mask layer on a first region of the upper surface of the epitaxial layer; (d) forming a semiconductor multi-layer structure on a second region of the upper surface of the epitaxial layer, wherein the second region is distinct from the first region; (e) removing the mask layer formed on the first region of the upper surface of the epitaxial layer; and (f) forming an electrode on the first region of the upper surface of the epitaxial layer.
1. A method of fabricating a light-emitting diode comprising the following steps:
(a) preparing a substrate;
(b) forming an epitaxial layer on the substrate, the epitaxial layer having an upper surface, and the upper surface comprising a first region and a second region distinct from the first region;
(c) forming a mask layer on the first region;
(d) forming a semiconductor multi-layer structure on the second region, and the semiconductor multi-layer structure comprising a lighting layer;
(e) removing the mask layer formed on the first region; and
(f) forming a first electrode on the first region of the upper surface of the epitaxial layer, wherein the height of the mask layer is substantially the same as that of the semiconductor multi-layer structure.
2. The method of claim 1 further comprising the following step:
(g) forming a second electrode on the semiconductor multi-layer structure.
3. The method of claim 1 , wherein the mask layer in step (e) is removed by a chemical agent.
4. The method of claim 1 , wherein the mask layer is made of silicon dioxide.
5. A method of fabricating a light-emitting diode comprising the following steps:
(a) preparing a substrate;
(b) forming an epitaxial layer on the substrate, the epitaxial layer having an upper surface, and the upper surface comprising a first region and a second region distinct from the first region;
(c) forming a mask layer on the first region;
(d) forming a semiconductor multi-layer structure on the second region, and the semiconductor multi-layer structure comprising a lighting layer;
(e) selectively etching a part of the mask layer to make a part of the first region uncovered; and
(f) forming a first electrode on the uncovered region of the first region.
6. The method of claim 5 further comprising the following step:
(g) forming a second electrode on the semiconductor multi-layer structure.
7. The method of claim 6 , wherein the height of the first electrode is substantially the same as that of the second electrode.
8. The method of claim 5 , wherein the mask layer is made of silicon dioxide.
9. A light-emitting diode comprising:
a substrate;
an epitaxial layer formed on the substrate, the epitaxial layer having an upper surface, and the upper surface comprising a first region and a second region distinct from the first region;
a mask layer formed on a part of the first region to make a part of the first region uncovered;
a semiconductor multi-layer structure formed on the second region, and the semiconductor multi-layer structure comprising a lighting layer;
a first electrode formed on the uncovered region of the first region; and
a second electrode formed on the semiconductor multi-layer structure.
10. The light-emitting diode of claim 9 , wherein the height of the mask layer is substantially the same as that of the semiconductor multi-layer structure.
11. The light-emitting diode of claim 9 , wherein the mask layer is made of silicon dioxide.
12. The light-emitting diode of claim 9 , wherein the height of the first electrode is substantially the same as that of the second electrode.