Semiconductor device and manufacturing method of the semiconductor device
View Patent ↗A semiconductor device including an n-type semiconductor substrate, a p-type channel region and a junction layer provided between the n-type semiconductor substrate and the p-type channel region is disclosed. The junction layer has n-type drift regions and p-type partition regions alternately arranged in the direction in parallel with the principal surface of the n-type semiconductor substrate. The p-type partition region forming the junction layer is made to have a higher impurity concentration than the n-type drift region. This enables the semiconductor device to have an enhanced breakdown voltage and, at the same time, have a reduced on-resistance.
1. A semiconductor device comprising:
a first conductivity type semiconductor substrate;
a second conductivity type channel region; and
a junction layer provided between the first conductivity type semiconductor substrate and the second conductivity type channel region, the junction layer having a plurality of first conductivity type semiconductor regions and a plurality of second conductivity type semiconductor regions alternately arranged in a direction running parallel with the principal surface of the first conductivity type semiconductor substrate,
the second conductivity type semiconductor region having a higher average impurity concentration than the first conductivity type semiconductor region,
the first conductivity type semiconductor region having an impurity concentration whose average value (N 1-semiconductor ) satisfies the following expression (1):
N
1
-
semiconductor
≥
ɛ
semiconductor
×
E
critical
2
4
×
q
×
V
BD
(
1
)
where V BD is the maximum preventable voltage of the semiconductor device, ε semiconductor is the permittivity of the semiconductor device, E critical is a critical electric field strength and q is the elementary charge;
the second conductivity type channel region having a plurality of trenches formed from the surface thereof so as to reach the junction layer, each of the trenches having an insulator film formed on the inside face and being filled with an electrode with the insulator film inbetween the trench and the electrode, and
an electric field strength in the vicinity of the trench being lower than an electric field strength in the junction layer.
2. The semiconductor device as claimed in claim 1 , wherein the electric field strength in the junction layer increases with an increase in distance from the bottom of the trench toward the first conductivity type semiconductor substrate.
3. A method of manufacturing a semiconductor device comprising:
forming a first conductivity type semiconductor layer by epitaxial growth on a first conductivity type semiconductor substrate with a specified impurity concentration, the first conductivity type semiconductor layer having an impurity concentration whose average value (N 1-semiconductor ) satisfies the following expression (1):
N
1
-
semiconductor
≥
ɛ
semiconductor
×
E
critical
2
4
×
q
×
V
BD
(
1
)
where V BD is the maximum preventable voltage of the semiconductor device, ε semiconductor is the permittivity of the semiconductor device, E critical is a critical electric field strength and q is the elementary charge;
forming a plurality of trenches in the first conductivity type semiconductor layer; and
forming a second conductivity type semiconductor layer by epitaxial growth in each of the trenches, the second conductivity type semiconductor layer having a higher impurity concentration than the first conductivity type semiconductor layer.
4. The method of manufacturing a semiconductor device as claimed in claim 3 , wherein the step of forming the first conductivity type semiconductor layer comprises growing a plurality of first conductivity type layers whose respective impurity concentrations are different from one another.